| Allicdata Part #: | ATS-05F-29-C3-R0-ND |
| Manufacturer Part#: |
ATS-05F-29-C3-R0 |
| Price: | $ 7.62 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-29-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.86070 |
| 30 +: | $ 6.45687 |
| 50 +: | $ 6.05329 |
| 100 +: | $ 5.64971 |
| 250 +: | $ 5.24619 |
| 500 +: | $ 5.14530 |
| 1000 +: | $ 5.04441 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor in the reliable operation of electronic equipment. Effective heat dissipation of components is essential to prevent excess heat from overstressing the component and reducing its lifespan. ATS-05F-29-C3-R0 is a type of heat sink designed to manage the heat generated by high performance electronic components.
The ATS-05F-29-C3-R0 is a three-layer, flat-top heat sink designed for enterprise-level server and storage applications. It is constructed of an aluminum base with a top layer of aluminum fins and a middle layer of copper for effective heat transfer. The unique design of the ATS-05F-29-C3-R0 features a staggered fin layout that helps to provide optimized airflow while minimizing turbulence. The fins are also coated with special thermal adhesive and come pre-assembled with thermal bonding tape for easy installation.
The ATS-05F-29-C3-R0 offers outstanding thermal performance due to its precise, engineered design. Its advanced thermal interface technologies reduce thermal resistance while providing excellent heat dissipation. The ATS-05F-29-C3-R0 also features a patent-pending lightweight frame design, which helps to ensure lower component temperatures. Additionally, its optimized airflow channels help to ensure cool, consistent operation.
The ATS-05F-29-C3-R0 is designed to handle a wide range of applications, including enterprise servers, workstations, storage and high-end PCs. It is an ideal solution for components that generate significant heat due to high performance requirements. This heat sink can also be used in conjunction with fans for improved cooling performance and additional cooling capacity.
The ATS-05F-29-C3-R0 is an ideal heat sink solution for thermal management of high performance electronic components. Its advanced design optimizes the airflow within the heat sink for improved performance and reduced thermal resistance. Its light weight frame helps to reduce component temperatures, while its patent-pending structure provides excellent heat dissipation. Its pre-assembled design ensures quick and easy installation while providing greater system efficiency.
The specific data is subject to PDF, and the above content is for reference