ATS-05F-38-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are a key component found in virtually every modern electronic device. They are designed to dissipate heat generated by components and keep them at a safe operating temperature. The ATS-05F-38-C1-R0 is a Thermal - Heat Sink specifically designed for medium-power applications. The purpose of this article is to explore the application field and working principle of the ATS-05F-38-C1-R0 Heat Sink, and to find out how it can be applied to modern applications.

ATS-05F-38-C1-R0 Heat Sink Design & Application

The ATS-05F-38-C1-R0 Heat Sink is designed for efficient cooling in medium-power applications, such as power supplies, telecoms, audio/video, LED lighting, industrial switches, low-end server racks and more. It is made of aluminum, making it lightweight and easy to install. The design uses an optimally-sized heatsink that can dissipate heat quickly, allowing for maximum efficiency and safety in applications.The ATS-05F-38-C1-R0 Heat Sink is designed to meet MIL-STD-810G and can operate in temperatures between -40C-85C and is vibration resistant. Its superior design and use of high-quality materials combined with its attractive price make it a very popular option for manufacturers.

Working Principle of the ATS-05F-38-C1-R0 Heat Sink

The ATS-05F-38-C1-R0 Heat Sink is designed to dissipate heat generated by components or by a system. It works by transferring heat away from the component or system and into the atmosphere.The heat sink consists of a finned structure that is made of aluminum, which is an excellent conductor of heat. The finned structure increases the surface area of the heat sink, allowing heat to be transferred away from the component or system more efficiently. The heat sink is designed to maximize airflow, allowing it to transfer more heat away from the component or system. The fins are arranged in a way that encourages air to flow over them from all directions, thus increasing the efficiency of heat transfer.

Conclusion

The ATS-05F-38-C1-R0 Heat Sink is a popular choice for medium-power applications such as power supplies, telecoms, audio/video, LED lighting, industrial switches, and low-end server racks. Its superior design and use of quality materials combine with its attractive price to make it a popular choice among manufacturers.The Heat Sink works by transferring heat away from components and systems, making use of its finned structure for maximum efficiency. The fins are arranged in a way that increases surface area and promotes air flow, thus allowing it to dissipate heat more quickly and safely.

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