| Allicdata Part #: | ATS-05F-44-C1-R0-ND |
| Manufacturer Part#: |
ATS-05F-44-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-44-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat Sinks are electronic components used to effectively and efficiently dissipate the heat generated by an electronic device into the surrounding environment. Heat Sinks come in varying shapes and sizes, and are made for different applications. ATS-05F-44-C1-R0 is a Heat Sink that is designed for high-power density applications.
This Heat Sink features a 5W design, offering an optimal solution for high power systems. It is manufactured using a high performance copper alloy which offers a great thermal transfer capability. The fin types in the Heat Sink are linear, that helps to reduce the thermal resistance. Compared to other Heat Sinks with comparable thermal performance, this model offers better operating efficiency and an improved system cooling capacity.
The ATS-05F-44-C1-R0 Heat Sink has a clip-type mounting structure, which allows for quick, easy, and secure installation. It also offers an increased surface area to ensure maximum heat dissipation and to provide a longer product life. The clip-type mounting structure also ensures that the Heat Sink is firmly fixed to the processor, thus preventing damage to the processor due to thermal expansion and contraction.
The working principle of the ATS-05F-44-C1-R0 Heat Sink is based on the heat exchange principle. Heat generated by the processor is transferred to the fin surface of the Heat Sink and then to the atmosphere via radiation and convection. This helps to dissipate the heat and keep the processor operating within its specified thermal range. Due to its increased surface area, the Heat Sink is able to dissipate more heat than other Heat Sinks with similar thermal performance.
The ATS-05F-44-C1-R0 Heat Sink is an ideal solution for high power density applications. It offers a great thermal transfer capability, increased surface area for maximum heat dissipation, and a clip-type mounting structure for easy and secure installation. This Heat Sink is suitable for a wide range of applications, including computer processors, computer peripherals, and telecommunication systems.
The specific data is subject to PDF, and the above content is for reference