| Allicdata Part #: | ATS-05F-52-C1-R0-ND |
| Manufacturer Part#: |
ATS-05F-52-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-52-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.10275 |
| 30 +: | $ 3.01896 |
| 50 +: | $ 2.85125 |
| 100 +: | $ 2.68349 |
| 250 +: | $ 2.51579 |
| 500 +: | $ 2.43193 |
| 1000 +: | $ 2.18034 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic components is essential for optimal performance and life expectancy. Poor thermal management can lead to component failures, signal integrity issues, and other problems. ATS-05F-52-C1-R0 Heat Sink is designed to provide thermal management for electronic components, ensuring efficient cooling and protection from thermal damage.
ATS-05F-52-C1-R0 is a finned-type, 2-piece heat sink. Its finned design helps to maximize surface area available for heat transfer. The heat sink is composed of extruded aluminum, and the fins are laser-cut. In order to promote efficient air flow, the fins are pointed outwards. This allows air to flow freely and steadily across the fins. The fins are press-fit onto the base, ensuring good heat transfer through the base and fins.
The ATS-05F-52-C1-R0 heat sink is a versatile solution for various electronics cooling applications. It can be mounted to flat surfaces with conventional screws. The entire unit has a low profile, making it suitable for cramped applications. Designed for optimal performance, it has a thermal resistance of 0.5°C/W.
It is an excellent choice for applications that require low profile and efficient cooling. Some of the common applications where the ATS-05F-52-C1-R0 can be used include industrial control systems, servers, power supplies, medical equipment, and audio amplifiers.
The ATS-05F-52-C1-R0 heat sink works on the principle of conduction and convection. It works by dissipating heat through the base and fins, where conduction takes place between the heat source and the heat sink. Then, the heat is transferred from the fins to the surrounding environment, which is known as convection cooling. The units are designed to ensure maximal heat dissipation to the surrounding environment, ensuring optimal thermal performance of the components.
In order to maximize the performance of the ATS-05F-52-C1-R0, an adequate air flow is necessary. The quality of the air flow can be enhanced further by using fans or directional coolers. Another important factor is the installation location. The location should be chosen carefully to ensure that the air flow is not restricted, thus preventing overheating.
ATS-05F-52-C1-R0 heat sink is a reliable and cost-effective solution for efficient heat transfer and thermal management of electronic components. Its finned design and low profile make it suitable for cramped applications, while its thermal resistance ensures optimal thermal performance. With its versatility, it can be used in a variety of applications, from industrial control systems to audio amplifiers. It is an ideal solution for anyone looking to optimize electronic systems and ensure component longevity.
The specific data is subject to PDF, and the above content is for reference