ATS-05F-60-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are widely used in many applications for the purpose of cooling vital components. They are typically made up of a metal or plastic body that houses a finned structure to dissipate heat from a hot device. This article focuses on ATS-05F-60-C1-R0 thermal-heat sink, which is a common and efficient cooling solution for high temperature applications.

Overview of ATS-05F-60-C1-R0

The ATS-05F-60-C1-R0 thermal-heat sink is a finned type heat sink designed for a variety of applications. It features an extruded aluminum base for heat dissipation with fins for additional cooling surface area. It also has a black anodized finish for improved corrosion resistance. Additionally, the ATS-05F-60-C1-R0 can handle up to 150 W of dissipated power without the need for additional cooling.

ATS-05F-60-C1-R0 Applications

The ATS-05F-60-C1-R0 is suitable for a variety of applications including LED lighting, medical imaging systems, transportation equipment, consumer electronics, communication systems, and high-power integrated circuits. It is particularly popular with hot components such as high-speed processors, power transistors, diodes, and field effect transistors.

Working Principle

The ATS-05F-60-C1-R0 is designed to reduce heat generated by devices by increasing the surface area of the heat sink. The finned structure of the sink serves to dissipate heat efficiently and quietly. The heat is dissipated from the device by conduction and convection, with the fins helping to maximize the rate at which the heat can be dispersed. Additionally, the aluminum construction of the sink allows for excellent heat diffusion and dissipation.

Installation

Installation of the ATS-05F-60-C1-R0 is relatively straightforward. The heat sink should be firmly and securely attached to the device using the appropriate hardware. It is necessary to ensure that the sink is firmly installed so that the heat can be effectively dissipated. The mounting holes on the sink should then be securely fastened following the manufacturer\'s instructions.

Conclusion

In conclusion, the ATS-05F-60-C1-R0 thermal-heat sink is an efficient and economical cooling solution for a variety of high-temperature applications. It is capable of handling temperatures up to 150 W without the need for additional cooling. Additionally, it features an extruded base with fins to provide increased surface area and a black anodized finish for improved corrosion resistance. Properly installed, the ATS-05F-60-C1-R0 can effectively dissipate heat and keep vital components at a safe operating temperature.

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