| Allicdata Part #: | ATS10128-ND |
| Manufacturer Part#: |
ATS-05F-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are a form of passive thermodynamic heat exchanger that transfers the heat generated by an electronic component or device to a fluid medium, usually air. Through its ability to manage or dissipate thermal loads, heat sinks are commonly used to protect delicate electronic components from overheating. Heat sinks can be used in a variety of applications from computer motherboards and CPUs to medical and industrial instrumentation.
The ATS-05F-63-C2-R0 heat sink is a type of heat sink designed to work with a variety of electronic devices. Its unique design features a metal-aluminum base with a carbon fiber thermal interface. It also has a patented Altimax technology which enables it to dissipate more heat from the component. The heat sink is also designed for optimal ventilation with its multiple layers of perforated fins that help move the air over the heat sink and reduce ambient temperature.
The ATS-05F-63-C2-R0 heat sink is designed for use with high-performance, high-power devices such as power transistor arrays, power amplifiers, and integrated circuits. Its unique fin design allows it to dissipate heat more effectively than other, less efficient heat sinks and protect the device from overheating. It is also designed to be lightweight and durable, making it suitable for long-term use in a variety of applications.
The working principle of the ATS-05F-63-C2-R0 heat sink is based on thermal transfer. The heat generated by the electronic device or component is transferred to the metal-aluminum base of the heat sink by the use of a thermal interface. The heat is then dissipated into the fin layer of the heat sink, which provides an effective ventilation system and helps reduce the ambient temperature.
The ATS-05F-63-C2-R0 heat sink is suitable for a wide variety of applications. It can be used in desktop and laptop computers, television sets, and other electronic devices where thermal management is essential. The heat sink can also be used in medical and industrial instrumentation to reduce thermal stress on sensitive components and protect them from damage due to excessive heat.
In summary, the ATS-05F-63-C2-R0 heat sink is a high-performance and reliable device specifically designed for thermal management applications. Its patented Altimax technology, lightweight design, and superior ventilation system make it suitable for a wide variety of applications, from consumer electronics to medical and industrial instrumentation. The heat sink is also designed to effectively dissipate heat and keep sensitive components and devices from overheating.
The specific data is subject to PDF, and the above content is for reference