| Allicdata Part #: | ATS10130-ND |
| Manufacturer Part#: |
ATS-05F-65-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-65-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to evenly disperse heat from a component in order to maximize its efficiency. Heat sinks are essential to many areas of technology as they help ensure that components, boards, and even electronics, runs optimally by regulating temperatures. The ATS-05F-65-C2-R0 heat sink is a versatile heat sink model that provides effective thermal dissipation in a wide range of applications.
Effectiveness
The ATS-05F-65-C2-R0 heat sink is designed to create a high surface area while minimizing the heat sink\'s footprint. This allows for optimal dissipation for high thermal density components and a consistent performance throughout the entire device. In addition, the ATS-05F-65-C2-R0 heat sink has integrated fins that help to improved the cooling efficiency of the device.
Compatibility
The ATS-05F-65-C2-R0 heat sink is a versatile heat sink that can be used in a variety of applications. It is compatible with transistors, LED lighting, diode modules, and more. It is also compatible with multiple PCBs, from those with small form factors to those with high component densities. The heat sink is also compatible with machines that are subject to extreme temperatures and moist environments.
Durability
The ATS-05F-65-C2-R0 heat sink is carefully constructed with durable aluminum and fins. This allows the heat sink to effectively dissipate heat while also protecting the components from damage. The fins are designed to be strong and lightweight to provide maximum heat dissipation with minimal space requirements. The aluminum construction is also corrosion resistant, making it ideal for long-term applications.
Installation
The ATS-05F-65-C2-R0 heat sink is designed for easy installation and maintenance. The heat sink is pre-assembled and can be quickly installed on most components. The ATS-05F-65-C2-R0 heat sink can also be easily cleaned and maintained due to its design.
Application Field and Working Principle
The ATS-05F-65-C2-R0 heat sink is ideal for a range of applications, from circuit boards and computers to medical devices and industrial equipment. The heat sink\'s mechanism for thermal management is based on the convection principle. As air moves around the fins of the heat sink, heat is conducted away from their surfaces. This reduces the surface Heat transfer coefficient (h), allowing the device to remain cooler.
Conclusion
The ATS-05F-65-C2-R0 heat sink is an advanced and versatile heat sink designed to provide efficient and dependable thermal management. The heat sink is suitable for a wide range of applications and is suitable for use in high temperature and moist environments. The heat sink is constructed with durable aluminum and integrates fins for improved cooling performance. It is also designed for easy installation and maintenance. The ATS-05F-65-C2-R0 heat sink is an ideal solution for an array of thermal management needs.
The specific data is subject to PDF, and the above content is for reference