| Allicdata Part #: | ATS-05F-84-C1-R0-ND |
| Manufacturer Part#: |
ATS-05F-84-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-84-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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As the demand for advanced technologies continues to grow, so does the need for thermal solutions to provide adequate cooling. Heat-sinks are one of the most popular means of heat dissipation, helping to reduce the operating temperature of electronic components. For this reason, ATS-05F-84-C1-R0 has been created to efficiently dissipate heat in complex applications.
ATS-05F-84-C1-R0 is a thin fin heat-sink consisting of a metallic base and a set of thin surfaces which stand perpendicular to the base. Its design allows for optimized heat dissipation, as well as versatile mounting options thanks to its open profile. It\'s an ideal solution for applications that require increased heat dissipation efficiency, while its slim profile ensures efficient thermal management in space-restricted designs.
The working principle of ATS-05F-84-C1-R0 is based on the concept of natural convection and radiation. Natural convection can occur when there is large difference between the two temperatures. This happens when air is heated up by a heat-sink, leading to higher air circulation around the heat-sink fins which are designed to maximize air contact. Radiation is the process of heat radiating from one surface to another. This happens when heat generated from the heat-sink is absorbed by surrounding surfaces, lowering the temperature of the heat-sink itself.
When it comes to heat-sinks, natural convection and radiation are the primary means of heat dissipation. As the heat-sink is exposed to a larger surface area and a larger temperature difference, the air will move more rapidly around the heat-sink fins, increasing the heat transfer rate while also increasing the amount of radiation absorbed by surrounding surfaces. This will result in greater heat dissipation efficiency and improved thermal management.
The ATS-05F-84-C1-R0 is the perfect solution for applications that require optimized performance in terms of heat dissipation. Its thin fin design ensures excellent heat dissipation, while its open profile allows for versatile mounting options. The ATS-05F-84-C1-R0 is a great choice for any application where efficient thermal management is essential.
The specific data is subject to PDF, and the above content is for reference