ATS-05G-117-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-05G-117-C1-R0 is a widely used thermal – heat sink manufactured by Advanced Thermal Solutions, Inc. (ATS). This thermal – heat sink is a versatile passive cooling solution for common applications in the computer and electronics industry. It is designed to provide a highly efficient thermal management solution to protect components from high temperatures during extended usage at high processing loads. It is capable of creating extremely low-pressure zones to increase air flow efficiency and thermal performance.

Design & Structure

The ATS-05G-117-C1-R0 features a sleek aluminum extrusion construction with two fins attached to the base with an aluminum heat sink. The two-fin design consists of one main fin and one rearward-used supplemental fin that increases the surface area and enhance the thermal performance of the heat sink. The top of the heat sink is sealed off with a thermally-sealed high-temperature gasket to prevent loss of heat. The top of the gasket also has two small windows for air intake which provide additional heat dissipation.

Application Field and Working Principle

The ATS-05G-117-C1-R0 is suitable for applications such as computer and electronics equipment, industrial machinery, and power converters. It is particularly well-suited for applications that require high levels of heat dissipation due to the high-performance two-fin structure, thermally-sealed gasket, and efficient heat transfer design. The working principle of this thermal – heat sink is based on the convection process. The heat generated by components is transferred to the heat sink via the fins which then dissipate the heat into the surrounding air. This leads to a cooling effect that helps to keep components within the designed operating temperature range.

Advantages

The ATS-05G-117-C1-R0 offers several advantages compared to other thermal solutions. Its two-fin structure provides increased surface area that allows it to effectively dissipate more heat and maintain lower temperatures. Additionally, it features a thermally-sealed gasket and efficient heat transfer design that further enhances its thermal performance. The heat sink also features two small windows for air intake which provides additional cooling and helps improve component performance.

Conclusion

Overall, the ATS-05G-117-C1-R0 is an excellent thermal – heat sink solution for applications in the computer and electronics industry. It provides an efficient thermal management solution for components that are subjected to high temperatures and intense processing loads. The two-fin structure and thermally-sealed gasket help to optimize heat dissipation and provide additional cooling. Additionally, the two windows for air intake offer further cooling and improved performance.

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