| Allicdata Part #: | ATS-05G-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-05G-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05G-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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:Thermal - Heat Sinks provide the best solution for turning unwanted mechanical energy into controlled thermal energy. ATS-05G-153-C3-R0 heat sink is a type of thermal management product designed for cooling electronic components in the computer industry. It has a high performance nickel-plated copper base and enclosed aluminum fin, which provide efficient heat transfer between the heat source and the air.
Application Field
ATS-05G-153-C3-R0 heat sink is widely used in the computer industry for cooling CPU processors in PCs, servers, and networks. It is also suitable for cooling graphics cards, power supplies, memory modules, and other sensitive electronic components that require additional cooling. Additionally, it can be used in industrial applications such as LED lighting, telecommunications, and other high power electronic products.
Working Principle
The working principle of ATS-05G-153-C3-R0 heat sink is simple. It features a copper base with an embedded heat-conductive element, which is connected to the aluminum fin. Heat from the source is absorbed by the copper base and transferred to the fins, where it is dissipated into the surrounding air. This process of heat transfer, also known as convection, is highly efficient and helps regulate electronics temperatures.
In addition, the heat sink features a unique patented design that provides superior cooling performance. The wider surface area of the fins increases the heat transfer rate, allowing the aluminum fins to absorb and dissipate more heat than standard heat sinks. The combination of the copper base and the fins helps to significantly reduce the temperature of the heat source, keeping it within the safe operating range.
ATS-05G-153-C3-R0 heat sink is an excellent example of thermal management products and is highly valued for its efficient cooling capabilities. It is a reliable and cost-effective way of cooling electronic components and keeps them reliable and safe.
The specific data is subject to PDF, and the above content is for reference