ATS-05G-200-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05G-200-C3-R0-ND

Manufacturer Part#:

ATS-05G-200-C3-R0

Price: $ 3.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05G-200-C3-R0 datasheetATS-05G-200-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.45933
30 +: $ 3.36588
50 +: $ 3.17898
100 +: $ 2.99193
250 +: $ 2.80496
500 +: $ 2.71146
1000 +: $ 2.43095
Stock 1000Can Ship Immediately
$ 3.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-05G-200-C3-R0 Application Field and Working Principle

A thermal-heat sink is a device that transfers heat, often generated through electricity, from an object to a coolant. Heat sinks are primarily used in electronics, computers, and other devices that use significant amounts of power and thus create significant amounts of heat. The ATS-05G-200-C3-R0 is a type of thermal-heat sink which has a wide range of applications in different industries.

Applications

The ATS-05G-200-C3-R0 heat sink is primarily used in electronic and computer parts. In personal computers, for example, the heat sink is often used to manage the temperatures of CPU and system chips, preventing them from overheating. It is also used to dissipate heat from system components such as the power supply and other peripherals. Additionally, the ATS-05G-200-C3-R0 is frequently used to draw heat away from automotive and aviation components, such as resistors, capacitors and transistors.

Design and Material Properties

The ATS-05G-200-C3-R0 is designed with a set of aluminum fins that are spaced apart and connected to a copper base that transfers heat from the fins to the surrounding environment. By distributing the heat with this design, the ATS-05G-200-C3-R0 is more efficient and requires less energy than traditional heat sinks. This also reduces the size and cost of the overall system. The copper base has a low thermal resistance for optimum thermal performance, while the aluminum fins are designed to be light weight and to dissipate heat quickly.

Working Principle

The working principle behind the ATS-05G-200-C3-R0 is fairly straightforward. The heat from the electronics is transferred from the copper base, up the aluminum fins, and into the surrounding environment. As the heat is transferred, the ambient air circulating around the system is slightly warmed, thus cooling the electronics. This system works most efficiently in an open, airy area. In a box or other confined space, the heat will transfer slower.

Conclusion

The ATS-05G-200-C3-R0 Thermal-Heat Sink is an efficient device used to dissipate heat from electronic devices such as computers and automotive parts. The design of the aluminum fins distributed over the copper surface allow for efficient heat transfer, while also reducing system size and cost. The working principle enables the heat from the device to be dissipated using only the surrounding environment, making for a cost-effective and efficient cooling solution.

The specific data is subject to PDF, and the above content is for reference

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