| Allicdata Part #: | ATS-05G-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-05G-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05G-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are widely used for a variety of applications, but the ATS-05G-72-C1-R0 is an especially important model. Its purpose is to utilize the physical properties of aluminum for heat dissipation, preventing components from overheating and sustaining potential catastrophic failure. In this article, we will take a look at the application and working principle of ATS-05G-72-C1-R0 heat sinks.
Application Field of ATS-05G-72-C1-R0 Thermal - Heat Sinks
ATS-05G-72-C1-R0 heat sinks are designed to dissipate the heat generated by CPUs, GPUs, and other electronic components. The heat sinks are constructed of high quality aluminum, which offers excellent thermal conductivity and dissipation. This, along with its light weight, makes it an ideal choice for many thermal‑related applications. For instance, the performance of processors can be improved by using a heat sink to dissipate the heat generated during operation. Additionally, heat sinks are often used in servers, which produce a significant amount of heat and require efficient cooling systems. Other applications include consumer devices, such as smartphones, tablets, and laptops.
Working Principle of ATS-05G-72-C1-R0 Thermal - Heat Sinks
The ATS-05G-72-C1-R0 heat sinks utilize the physical properties of aluminum to dissipate heat away from components. The design of the heat sink consists of multiple horizontal fins that are arranged in parallel. These fins have a larger surface area compared to a solid block, providing more efficient heat conduction and dissipation. The fins are attached to a base plate, which is in direct contact with the component to be cooled. As the heat is conducted away from the component, the fins dissipate the heat away from the base plate, effectively cooling the component.
Heat sinks typically employ a fan or other type of forced-air cooling system. The fan is used to draw in air from the outside of the heat sink and blow it over the fins, promoting the heat transfer by convection. This increases the efficiency of heat transfer, allowing more heat to be removed from the component and dissipated away more quickly.
Conclusion
The ATS-05G-72-C1-R0 thermal - heat sinks are an essential cooling solution for electronic components. The heat sinks are engineered from high-quality aluminum and feature a design that maximizes the fin surface area for efficient heat transfer. The fins are then cooled by a fan or other forced-air cooling system, allowing the sink to quickly and efficiently dissipate heat away from the component, helping to prevent catastrophic failure.
The specific data is subject to PDF, and the above content is for reference