ATS-05G-75-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05G-75-C3-R0-ND

Manufacturer Part#:

ATS-05G-75-C3-R0

Price: $ 3.44
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05G-75-C3-R0 datasheetATS-05G-75-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.12669
30 +: $ 3.04206
50 +: $ 2.87305
100 +: $ 2.70409
250 +: $ 2.53507
500 +: $ 2.45056
1000 +: $ 2.19705
Stock 1000Can Ship Immediately
$ 3.44
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are devices that are designed to transfer heat away from a particular component or system to keep it cool. ATS-05G-75-C3-R0 is a high-performance heat sink that is designed to effectively dissipate heat away from delicate electronics and maintain optimal temperatures.

The ATS-05G-75-C3-R0 thermal-heat sink is a rugged, fanless heat sink with a slim profile and a fin arrangement that allows for maximum air flow. Its form factor is designed to fit easily into tight spaces and its fins are arranged for optimal heat dissipation. The fin style also ensures long-term stability and maximum efficiency. This heat sink is made with high thermal conductivity aluminum and comes with a mounting bracket that allows for ease of installation.

The ATS-05G-75-C3-R0 thermal-heat sink is designed for applications that require optimal heat dissipation from components and systems. This device can be used for applications such as liquid and air cooling systems, computers and electronics, power supplies and motors, audio and video equipment, military and aerospace electronics, and automotive and wireless electronics. Its high thermal conductivity and efficient fin arrangement allows it to quickly transfer heat away from the component or system that it is cooling. This prevents overheating and damage to delicate electronics and allows for optimal performance.

The ATS-05G-75-C3-R0 thermal-heat sink works by dissipating heat away from the component or system that it is mounted on. Heat is transferred from the hot source to the cooler heat sink through conduction and once the heat reaches the fins, it is dissipated by convection. The air moving through the fins removes the heat, while the fins are made to ensure maximum air flow. This allows for a fast, efficient, and effective cooling system for delicate electronics.

This thermal-heat sink is designed for both commercial and industrial applications and is ideal for those needing reliable and efficient cooling solutions for their electronics. The ATS-05G-75-C3-R0 is an excellent choice for those looking to provide their components and systems with a reliable cooling solution that can handle extreme temperatures and prevent overloading and damage. Its slim profile and efficient fin arrangement make it easy to install and provide reliable, long-term cooling for any application.

The specific data is subject to PDF, and the above content is for reference

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