| Allicdata Part #: | ATS-05H-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-05H-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important and ambitious aspects of technology today. Therefore, it is essential to develop thermal products that can guarantee optimum performance at all levels. The ATS-05H-02-C3-R0 is a technology offering from Advanced Thermal Solutions, which provides advanced thermal management solutions for a multitude of industries. This particular technology is designed and developed as a heat sink.
The thermal management of the ATS-05H-02-C3-R0 is based on the principles of heat transfer between materials. Specifically, the technology utilizes the power of convection and radiation to manage the distribution of heat. The solution also relies on natural airflows to ensure that heat is moved to the desired points. With this technology, heat is efficiently and quickly distributed in a three-dimensional manner, so that it is effective in a wide variety of applications.
The advantage of the ATS-05H-02-C3-R0 is that it offers maximum performance and reliability. This is due to its capability to perform and control the rate of heat transfer quickly and efficiently. Additionally, its fully encapsulated construction and its multiple stage fin design ensures that it can easily handle high amounts of heat with minimal air leakage.
The technology is also customizable for various applications. It can be customized for consumer, industrial and military applications. Moreover, the design allows users to select a wide variety of cooling fins and fan shrouds to match the specific needs of their application. Furthermore, it can be used to cool a wide variety of components including CPUs, GPUs, and microprocessors.
The ATS-05H-02-C3-R0 heat sink technology is an advanced solution for thermal management. Its convection and radiation based principles make it very efficient in thermal management, while its customizable design makes it suitable for a range of applications. Furthermore, its fully encapsulated design and multiple stage fins provide maximum performance and reliability. With these advantages, it is a perfect fit for various industrial, consumer, and military applications.
The specific data is subject to PDF, and the above content is for reference