| Allicdata Part #: | ATS-05H-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-05H-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are components designed to optimize the dissipation of thermal energy produced by a device such as an electronic component or an artificial system. The need for Heat Sinks arises when the heat generated by a device or system is beyond the capability of its cooling capacity to dissipate that energy. Heat sinks are used to remove heat from components to prevent the potential of damage, increased cycle time, or too high of an operating temperature. Heat sinks are particularly important for today’s electronics as many are using higher and higher energy levels.
The ATS-05H-05-C1-R0 is a Heat Sink designed to dissipate up to 5 watts of thermal energy. It is designed to be used in various environments and can handle temperatures up to 600 degrees Celsius. The ATS-05H-05-C1-R0 is capable of dissipating up to 5 watt of thermal energy using a unique combination of base and fin structure. It is constructed from aluminum which ensures strong and efficient heat transfer between the base and the fins. The aluminum is treated with a special coating to ensure durability and longevity.
The ATS-05H-05-C1-R0 Heat Sink is a passive heat dissipator, meaning it does not require any additional power to accomplish its thermal transfer. As with any heat sink, the ATS-05H-05-C1-R0 Heat Sink achieves this by increasing the surface area of the device. The fins of the heat sink are designed to maximize surface area and air flow, allowing the heat sink to dissipate the generated heat quickly and efficiently. The unique fin and base design of the ATS-05H-05-C1-R0 allows for optimized heat dissipation, and efficient, even heat transfer from the base to the finned vanes.
The ATS-05H-05-C1-R0 can be used in a variety of applications and environments. It is an ideal solution for dissipating thermal energy generated by electronics such as CPUs, GPUs, laptop processors, and any other components or systems that generate a lot of heat. Additionally, it can be used in industrial, vehicular, and any other environment that requires efficient and effective thermal transfer. It is also suitable for applications with power supplies, LED lighting systems, and test and measurement systems.
The ATS-05H-05-C1-R0 Heat Sink is a reliable and efficient method of dissipating thermal energy from electrical components and systems. Its aluminum construction and unique fin and base design make it an ideal solution for a wide variety of applications, from industrial to vehicular. It is a cost-effective and efficient way to dissipate heat energy and ensure the components and systems being cooled are operating at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference