| Allicdata Part #: | ATS-05H-124-C3-R0-ND |
| Manufacturer Part#: |
ATS-05H-124-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-124-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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\Thermal management of electronic components is an important consideration for any application. The ATS-05H-124-C3-R0 is a thermally managed heat sink designed to dissipate large amounts of heat away from sensitive electronic components. The heat sink is designed for use in electrical installations and is certified to meet UL, CUL, and IEC60950 standards.
The ATS-05H-124-C3-R0 features a passive cooling mechanism which is based on a combination of thermal conduction and convection, as well as a cooling fan. This combination helps ensure efficient cooling and effective heat dissipation of the sensitive components. The heat sink is designed to provide a maximum thermal resistance of 0.56°C/W and can operate in temperatures up to 95°C. Additionally, the heat sink is designed to be relatively quiet, with a fan noise rating of no more than 35dBA.
The ATS-05H-124-C3-R0 is designed to dissipate heat away from any type of electronic component, ranging from microprocessors to transistors and LEDs. The design of the heat sink allows it to be mounted both horizontally and vertically for flexibility and convenience. It is also designed for easy installation with no added hardware required. The heat sink features a center-mount shape, and its construction is a four-layer laminate material with copper plated aluminum that is conductively bonded to both sides of the aluminum frame.
The heat sink is designed to provide superior heat dissipation and thermal management for long-lasting and reliable performance. It is the perfect choice for any application requiring a high level of thermal management. The heat sink is available in both standard and custom sizes to meet the particular needs of any application.
The ATS-05H-124-C3-R0 thermal heat sink is an excellent choice for any application requiring superior thermal management. Its design and construction are ideal for dissipating heat away from sensitive electronic components, and its passive cooling design helps ensure a dependable and long-lasting performance. Its easy installation and wide range of sizes make it the perfect choice for any thermal management application.
The specific data is subject to PDF, and the above content is for reference