| Allicdata Part #: | ATS10410-ND |
| Manufacturer Part#: |
ATS-05H-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal management and effective heat dissipation is critical in the engineering of a reliable circuit board system. In order to meet the demanding requirements of today’s high-power electronic components such as processors and PC motherboards, active cooling, and passive cooling products have been developed over time and are becoming increasingly popular with circuit board designers. Among the common heat dissipating products offered is the ATS-05H-134-C2-R0, which has become an increasingly popular choice for the thermal management needs of circuit board systems.
The ATS-05H-134-C2-R0 is part of the Thermal - Heat Sinks category of cooling products that are used to keep important components such as processors cool under the intense temperatures that are generated during extended circuit board operations. The ATS-05H-134-C2-R0 comprises of a ventilation fin, or heat sink, with an exposed surface area that is thermally connected to the component it is cooling. It also includes a built-in fan that circulates air through the fins and is used to further cool the component. The fan is powered using a two-lead connection.
The ATS-05H-134-C2-R0 is commonly used for cooling memory chips, which are prone to overheating during operation since they run at a very high frequency and demand a great deal of power. In addition, the ATS-05H-134-C2-R0 can be used for cooling other components such as voltage regulators and voltage sense amplifiers, which also tend to generate a lot of heat.
The working principle of the ATS-05H-134-C2-R0 utilizes the cooling power of air. The fan draws in air from outside the device and pushes it over the cooling fins. This air is then cooled as it passes through the fins and is then blown out of the device. As the air passes through the fins, it dissipates heat away from the heated components, which keeps the circuit board system running at optimal temperatures.
The ATS-05H-134-C2-R0 is designed to work in harsh operating environments and boasts both a natural convection heat sink as well as a thermosiphon heat dissipation system. The natural convection heat sink helps to keep the heat generated by the processor away from other components and disperse it into the surrounding environment. The thermosiphon heat dissipation system helps to further draw heat away from the processor by forcing cooled fluid through channels in the heat sink fins.
The ATS-05H-134-C2-R0 is a popular choice for circuit board systems in need of effective thermal management solutions. Its efficient design and reliable performance have made it a trusted choice for many engineers or users who rely on the reliability of their circuit board systems.
The specific data is subject to PDF, and the above content is for reference