ATS-05H-15-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-05H-15-C2-R0

ATS-05H-15-C2-R0 is a thermal component that is used to dissipate heat from electronic devices. It is commonly used in applications which require a high degree of thermal dissipation efficiency, such as the cooling of high-powered CPUs, GPUs, and FPGAs. This type of heat sink, like many other thermal components, can be attached to a component with the combination of a clip or adhesive and fasteners.

Applications of ATS-05H-15-C2-R0

The ATS-05H-15-C2-R0 heat sink is used in a range of applications, including automotive, telecoms, computers, medical equipment, and industrial applications. It is often applied in applications which have high-power components that require fast and efficient cooling.The primary application of ATS-05H-15-C2-R0 is in the cooling of electronic components. Highly efficient heat sinks, such as the ATS-05H-15-C2-R0, help limit the amount of heat generated by the component, ensuring that the component does not overheat and cause potential damage.The ATS-05H-15-C2-R0 also has applications in electronic enclosures, where it can be used to ensure components stay within specified temperature limits. This is particularly useful in applications where noise from fans or other components must be minimized.

Working Principle of ATS-05H-15-C2-R0

The working principle of the ATS-05H-15-C2-R0 relies on the transfer of heat away from the component by convectional processes. This type of transfer is made possible by the fin structure of the heat sink, as it increases the surface area of the heat sink in contact with the surrounding airflow.The fins dissipate the heat away from the component, and as the fin structure is typically made from aluminum or copper, the heat is quickly conducted away from the component and away from the surrounding environment.The heat then passes through the aluminum or copper fins, which are attached to a frame with a thermal adhesive. The fin structure, with its tightly packed columns, also creates a chimney effect which encourages air movement over the fins and further supports convectional heat transfer away from the component.

Conclusion

The ATS-05H-15-C2-R0 heat sink is an effective way of dissipating heat from electronic components, allowing them to perform at their best. This type of heat sink works using convectional heat transfer, and this is enabled by its fin structure which increases the surface area of the heat sink in contact with the surrounding air. The ATS-05H-15-C2-R0 has a range of applications, including automotive, telecoms, computers, medical equipment, and industrial applications.

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