| Allicdata Part #: | ATS-05H-189-C3-R0-ND |
| Manufacturer Part#: |
ATS-05H-189-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-189-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to dissipate heat from electronic components. The ATS-05H-189-C3-R0 is a high-performance heat sink designed specifically for serious thermal management applications. This thermal - heat sink is a popular choice for applications that require fast response and a high level of efficiency. The ATS-05H-189-C3-R0 comes in a variety of sizes and styles, so it is adaptable to various applications. It is a great choice for components that require consistent thermal performance.
This heat sink has a unique design that helps to elevate the temperature of electronic components to its optimal operating level. ATS-05H-189-C3-R0 uses a combination of aluminum fins and copper base plates that act as an effective heat spreader. The fins are arranged in a grid pattern that increases the air flow rate and promotes more rapid heat dissipation. The copper base plates are paired with the fins to provide an efficient system for transferring heat away from the components.
For applications that require a high degree of thermal management, the ATS-05H-189-C3-R0 uses aluminum profiles and a silicon dielectric compound to minimize air gap turbulence and enhance heat dispersion. The aluminum profiles provide a rigid structure and allow the thermal grease to be evenly distributed between the heat sink base and the components. The dielectric compound helps to seal the air gaps between the aluminum profiles and dissipate hot spots created by uneven temperature distribution.
The ATS-05H-189-C3-R0 is designed to be extremely efficient and responsive. Its large surface area and fins provide spacious air channels that maximize air volume and heat transfer. Its optimized bottom curvature increases surface contact between the heat sink and components for superior heat dissipation. This allows the ATS-05H-189-C3-R0 to deliver a much better thermal performance than competitors\' solutions.
Due to the low thermal resistance and high efficiency of the ATS-05H-189-C3-R0, it is commonly used in workstation PCs, gaming laptops and notebooks, and servers. It has also become a popular choice for applications such as embedded systems, automotive systems, and medical electronics. Its rugged construction and reliable performance make it suitable for industrial and military applications.
The ATS-05H-189-C3-R0 is an impressive thermal - heat sink solution that offers maximum efficiency and performance. Its unique design maximizes heat transfer and airflow, while its robust construction ensures reliability. With its high effectiveness and low-cost, it is a great option for applications needing efficient thermal management.
The specific data is subject to PDF, and the above content is for reference