| Allicdata Part #: | ATS-05H-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-05H-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal technology, or more specifically, thermal management, is a general term that encompasses a variety of systems, processes and technologies used to control the temperatures of electronics and other electronic-based objects. Thermal management is the process of controlling the temperature of an electronic object by proper selection of materials. At the core of most thermal management systems is a heat sink, which is a device that is used to absorb and dissipate heat away from an object in order to prevent its temperature from reaching damaging levels. The ATS-05H-192-C1-R0 is a high performance, single-slot copper base heat sink designed for cooling multi-chip modules, such as CPUs, GPUs and FPGAs (field-programmable gate array).
The ATS-05H-192-C1-R0 is designed to fit nicely and fit efficiently into any personal computer system within a few hundred dollars. This heat sink is made from high grade copper alloy material, featuring a series of fins that are designed to dissipate heat away from the heat source. The ATS-05H-192-C1-R0 base is machined to be extremely flat and has an excellent thermal performance that enables it to keep the core temperatures of processors and other components at an optimal level. Additionally, it also utilizes a unique clip system that helps ensure a secure and reliable fit for any CPU or other module that needs to be cooled.
The operational principle of the ATS-05H-192-C1-R0 is quite simple. The heat source, usually in the form of a CPU, GPU or FPGA, produces heat that the heat sink then absorbs. Insulating layers are also placed between the heat source and the heat sink. The fins help transfer the heat away from the surface of the heat sink and into the surrounding environment. This keeps the heat source from reaching dangerously high temperatures. Additionally, the unique clip system allows for a secure fit and helps ensure that the heat sink can effectively dissipate the trapped heat.
The ATS-05H-192-C1-R0 is an ideal cooling solution for systems that require intense computing power while keeping the temperature of their components under control. It is highly recommended for use in overclocking or gaming computers, servers, workstations, high-end PC systems, and many other places where efficient thermal management is necessary. It can also be used in industrial operations, including data centers and automotive applications, where it is necessary to keep the heat generated by electronic components under tight control.
With its outstanding features and extensive applications, the ATS-05H-192-C1-R0 copper base heat sink stands out as one of the best cooling solutions for electronics today.
The specific data is subject to PDF, and the above content is for reference