| Allicdata Part #: | ATS-05H-199-C3-R0-ND |
| Manufacturer Part#: |
ATS-05H-199-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-199-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are used to dissipate heat from components and regulate temperature in electronic systems. Heat transfers from the component to the heat sink, where it is further dispersed through its surface area. Thermal management solutions are an important part of maintaining optimal operating temperatures within application specific systems. A heat sink\'s size and design are unique to the system and component it is applied to.
The ATS-05H-199-C3-R0 is a highly specialized heat sink designed for use in consumer grade electronic devices. It has a highly efficient design that provides superior cooling performance, even in the smallest spaces. The ATS-05H-199-C3-R0 is able to dissipate the high temperatures of many components in consumer devices, making it an ideal choice for a wide variety of applications. The device has been designed to provide an expansive effective surface area, enabling it to reduce heat buildup quickly and efficiently and maintain optimal temperature.
The ATS-05H-199-C3-R0 is designed with a combination of anodized extruded aluminum fins and silicon-based material, making it an ideal solution for thermal management in consumer grade electronic devices. Its fin structure is designed to maximize the air flow for high performance cooling, and its effective surface area increases the level of heat dissipation. It is also designed to exclude dust and dirt, ensuring that the system remains dust and debris free, while its strategically placed thermal pads and gaskets guarantee a secure fit and seal.
The ATS-05H-199-C3-R0 is easy to install and mount, requiring little to no additional tools thanks to its customizable clip-on mounting hardware. The hardware is designed to ensure the device is securely mounted and its contact pad is flush with the surface. The device is also specially designed to fit the unique needs and dimensions of consumer grade electronic devices, providing an exact fit without any modifications needed.
The ATS-05H-199-C3-R0 is also designed to be extremely durable and resistant to the environmental conditions present in consumer grade electronic devices. The device is made from corrosion and chemical resistant materials, ensuring a longer lifespan. It is also designed to offer superior electrical conductivity without compromising its overall thermal efficiency or strength, making it a reliable component.
The ATS-05H-199-C3-R0 is an ideal thermal management solution for consumer electronic devices. It is designed to provide superior cooling performance and efficient dissipating of heat, even in cramped spaces. Its highly efficient design and durable construction make it an ideal choice for a variety of applications. With its customizable mounting hardware, easy installation, and reliable performance, the ATS-05H-199-C3-R0 is a cost-effective thermal management solution for consumer electronic devices.
The specific data is subject to PDF, and the above content is for reference