ATS-05H-24-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-05H-24-C1-R0-ND

Manufacturer Part#:

ATS-05H-24-C1-R0

Price: $ 4.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05H-24-C1-R0 datasheetATS-05H-24-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.08303
30 +: $ 3.85623
50 +: $ 3.62943
100 +: $ 3.40257
250 +: $ 3.17573
500 +: $ 2.94889
1000 +: $ 2.89218
Stock 1000Can Ship Immediately
$ 4.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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The ATS-05H-24-C1-R0 is a type of Heat Sink, designed to help manage thermal energy produced by electrical components. It uses an active air cooling system to move the generated heat from the component to the surrounding environment. Heat sinks are important to maintain a stable temperature to ensure correct operation of the circuit.

The ATS-05H-24-C1-R0 is constructed from a durable aluminum alloy body. It contains a fin assembly which is arranged in an aligned way to provide a larger cooling area. The fins are designed with an optimized shape to ensure a higher flow rate and better cooling performance. The ATS-05H-24-C1-R0 is available in multiple fin densities and sizes to meet different user requirements.

The ATS-05H-24-C1-R0 thermal heat sink features a high heat transfer efficiency. This makes it suitable for high performance applications where cooling is important. The heat sink also offers a low pressure drop thus reducing the overall system power consumption. It is important to note that the ATS-05H-24-C1-R0 can only dissipate the amount of heat generated by the component. Therefore, it is important to ensure that the component is properly designed to handle the heat generated.

The ATS-05H-24-C1-R0 application field covers a wide range of electronics such as communication equipment, computers, tablets and other electronic devices which generate a lot of heat during operation. It is also used in the automotive industry for cooling the internal components such as sensors, microprocessors and other controls.

The ATS-05H-24-C1-R0 works on the principle of heat convection. When a hot component transfers heat to the heat sink, air around the heat sink absorbs this heat and gets heated. This warm air rises and escapes from the heat sink, creating a vacuum at the bottom of the sink. This vacuum then allows cooler air to be sucked in, creating a convection cycle. This cycle is can be repeated multiple times, helping dissipate the heat from the source and cool the system.

Overall, the ATS-05H-24-C1-R0 is an efficient thermal heat sink which helps dissipate the heat generated by the component in a variety of applications. Its high heat transfer efficiency, low pressure drop and optimized fin design makes it suitable for high performance applications. Make sure to use the appropriate component design and cooling system to maximize the performance of the ATS-05H-24-C1-R0.

The specific data is subject to PDF, and the above content is for reference

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