| Allicdata Part #: | ATS-05H-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-05H-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat dissipation is an important consideration in the design of any electronic device, as both its speed of operation and lifetime can be affected by the amount of heat generated in the device. When a device is placed in an environment that is too hot, it can suffer from malfunctions as the components cannot keep up with the heat produced. Heat sinks are designed to help dissipate this excess heat and protect the device from overheating, or even permanent damage due to too much heat.
The ATS-05H-30-C3-R0 thermal heat sink is a high-performance solution that is designed to provide an efficient way to dissipate heat from high-power electronics. The heat sink is made from high-grade aluminum and is designed for high heat flux applications, making it a great choice for environments where the air temperature is too high for components to operate safely. Additionally, the heat sink’s design allows for maximum airflow, which helps ensure that heat is dissipated quickly and efficiently.
The ATS-05H-30-C3-R0 thermal heat sink is designed for use in a wide range of applications, including industrial control systems, power electronics, computers, electronics racks, laser systems, and more. It is especially well-suited for environments with high temperatures, where an efficient cooling system is necessary to keep components and systems safe. Additionally, the heat sink is designed to be easy to install and require minimal maintenance, making it an ideal choice for both short-term and long-term projects.
The ATS-05H-30-C3-R0 thermal heat sink is designed to move heat from the base of a component to an external environment quickly and efficiently using an array of metal fins. The fins act as a large surface area on which heat can be quickly dissipated, allowing for much higher thermal capacities than a standard heat sink. Additionally, the ATS-05H-30-C3-R0 thermal heat sink is designed with a zero-clearance fin gap, which helps to improve heat dissipation and prevent dust buildup.
The ATS-05H-30-C3-R0 thermal heat sink is designed to provide an efficient and reliable solution for the cooling of a range of electronic components. Its design allows for maximum airflow, helping to ensure that heat is dissipated quickly and efficiently. Additionally, its high-grade aluminum construction and zero-clearance fins make it a great choice for environments with high temperatures. With its simple installation and minimal maintenance requirements, the ATS-05H-30-C3-R0 thermal heat sink is an ideal choice for any application that requires efficient and reliable cooling.
The specific data is subject to PDF, and the above content is for reference