| Allicdata Part #: | ATS-05H-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-05H-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic components is essential for their reliable performance and longevity. The ATS-05H-32-C2-R0 heat sink is a simple yet efficient device designed to dissipate heat over a large surface area, allowing electronics to stay cool under normal operating conditions and preventing heat buildup and possible damage to the component.
The ATS-05H-32-C2-R0 is a passive heat sink consisting of a metal base and a series of aluminum fins. Its design makes it suitable for applications which require a high dissipation capacity from a compact device. The fins are spaced evenly reflect the heat through radiation and convection, while the base serves as a heat sink with a large surface area that can be used to mount the device onto the application board.
The ATS-05H-32-C2-R0 works by transferring the heat from the electronic components to the fins and then out into the atmosphere. This is accomplished by the law of thermodynamics, which states that heat always flows from warmer objects to cooler ones that it can in turn disperse. In this way, the heat created by the component is dissipated quickly over a large surface area, reducing the internal temperature of the device.
The thermal design of the ATS-05H-32-C2-R0 heat sink is specifically tailored to meet the needs of high-performance computer systems and other electronics devices that require efficient cooling solutions. As such, it features a series of fins with high thermal conductivity, which means that it can quickly and easily dissipate heat away from the electronic components. Additionally, its large surface area allows for optimal airflow to facilitate the dissipation of heat. Additionally, the aluminum material used in the construction of the fins ensures that the device has a long lifespan and is able to maintain its performance for a long period of time.
The ATS-05H-32-C2-R0 heat sink is a great choice for applications that require efficient cooling of critical components. Its compact size allows it to be used in areas where space is limited, while its high thermal conductivity allows it to effectively dissipate heat away from the electronic components. Moreover, its aluminum fins ensure that it is durable and has a long lifespan. The ATS-05H-32-C2-R0 heat sink is therefore an ideal choice for thermal management in high- performance computer systems and other electronic devices.
The specific data is subject to PDF, and the above content is for reference