| Allicdata Part #: | ATS-05H-38-C1-R0-ND |
| Manufacturer Part#: |
ATS-05H-38-C1-R0 |
| Price: | $ 5.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-38-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.01984 |
| 30 +: | $ 4.74117 |
| 50 +: | $ 4.46216 |
| 100 +: | $ 4.18333 |
| 250 +: | $ 3.90444 |
| 500 +: | $ 3.62555 |
| 1000 +: | $ 3.55582 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the performance and reliability of electronic products. Heat generated by sophisticated integrated circuits and other electronic components must be dissipated quickly and efficiently in order to prevent them from being damaged due to high temperatures. Heat sinks are one of the key components used to manage thermals in electronic products, and the ATS-05H-38-C1-R0 is an effective heat sink designed for applications that require a low-profile, cost-effective solution.
The ATS-05H-38-C1-R0 is a low-profile, surface-mount heat sink. It is made of high-quality aluminum and is designed to satisfy the needs of various applications that require a balance between performance and cost efficiency. The heat sink has an overall dimension of 38mm x 24mm x 2.47mm. It is designed with a high-performance fin geometry and an enhanced cooling performance due to its increased heat-dissipating area.
The ATS-05H-38-C1-R0 is designed for thermal applications that require a low-profile, cost-effective, and efficient heat sink solution. It offers advanced thermal performance and is suitable for cooling devices such as mobile phones, tablets, servers, and other electronic components that generate heat.
The working principle of the ATS-05H-38-C1-R0 is based on the convection of heat from the heat source to the outside air. Convection occurs when a hot gas or liquid comes into contact with a cooler material. In the case of the ATS-05H-38-C1-R0, heat is transferred from the source to the extractor fins, which can dissipate the heat into the surroundings more efficiently. The fanless design of the heat sink also allows for the elimination of noise and vibration associated with active cooling solutions.
The ATS-05H-38-C1-R0 heat sink offers a reliable, cost-effective, and low-profile solution that can be used in a variety of applications. It is an ideal solution for devices that require efficient cooling within a low-profile design. Furthermore, it is a versatile and efficient way to manage thermals in various applications such as mobile phones, servers, and other electronic components.
The specific data is subject to PDF, and the above content is for reference