| Allicdata Part #: | ATS-05H-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-05H-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05H-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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<p>Heat sinks are essential components in many applications where efficient and reliable heat dissipation is required.</p><p>The ATS-05H-50-C3-R0 is a compact, lightweight heat sink manufactured by Alpha Technologies. The product is designed for use in applications where sizing and weight constraints are critical. This heat sink features a passive cooling design that utilizes a combination of sub-micron aluminum material to effectively dissipate heat.</p><p>The ATS-05H-50-C3-R0 features a low profile, allowing it to be installed in low-clearance spaces. The product also features a high-performance surface treatment that optimizes its heat dissipation capabilities. Additionally, the heat sink is designed to meet the requirements of the Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) markets.</p><p>In terms of application field, the ATS-05H-50-C3-R0 is suitable for use in automotive, consumer electronics, medical, telecommunications, and industrial applications. It can be used in applications that require efficient heat dissipation, such as in power electronics, power supplies, regulators, modules, microprocessors, and other semiconductor devices. Additionally, it is also suitable for use in devices that require forced cooling due to their high operating temperature.</p><p>In terms of working principle, the ATS-05H-50-C3-R0 utilizes a combination of an aluminum base and a copper heat plate. The heat plate has a series of fins that form a wicking pattern to create maximum surface area for heat dissipation. Furthermore, the copper heat plate is designed so air can pass through it, allowing it to function as a heat exchanger. Additionally, the heat sink also features internal ribs that can help increase the amount of heat that is dissipated.</p><p>Overall, the ATS-05H-50-C3-R0 is an ideal choice for applications requiring reliable and efficient heat dissipation. Thanks to its compact size, the product is suitable for use in a variety of environments. Furthermore, its combination of an aluminum base and a copper heat plate ensures efficient heat dissipation. Thus, the ATS-05H-50-C3-R0 is an excellent choice for applications that require dependable and effective heat dissipation.</p>The specific data is subject to PDF, and the above content is for reference
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