ATS-06A-100-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06A-100-C3-R0-ND

Manufacturer Part#:

ATS-06A-100-C3-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-100-C3-R0 datasheetATS-06A-100-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.22163
30 +: $ 3.98727
50 +: $ 3.75278
100 +: $ 3.51823
250 +: $ 3.28369
500 +: $ 3.04914
1000 +: $ 2.99050
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.79°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal transfer is essential to keeping a variety of applications cool and safe. Heat sinks are a critical component of any application, and the ATS-06A-100-C3-R0 heat sink is designed to meet a range of thermal management needs. This article will explain the application field of the ATS-06A-100-C3-R0 and its working principle.

Application Field of ATS-06A-100-C3-R0 Heat Sink

Developed by US manufacturer Advanced Thermal Solutions, ATS-06A-100-C3-R0 heat sinks are designed for a wide range of high-performance applications. This heat sink is most often used in demanding applications, such as servers and high-end gaming systems, where heat transfer needs to be managed effectively. The ATS-06A-100-C3-R0 is also a popular choice for high-power LED lighting systems for its level of thermal management.

The materials used to construct the ATS-06A-100-C3-R0 heat sink are carefully selected to ensure excellent thermal transfer capabilities. The heat sink is made from black anodized aluminum, which is a high-performance material for heat transfer applications. The aluminum used for the ATS-06A-100-C3-R0 is also lightweight, making it easy to install in a variety of different applications.

The ATS-06A-100-C3-R0 also features a clip-on fan mount for easy installation. This allows the heat sink to be quickly installed in any application. Additionally, the ATS-06A-100-C3-R0 has a mounting kit, which includes mounting brackets and screws, for effortless installation.

Working Principle of ATS-06A-100-C3-R0 Heat Sink

Heat sinks work by dissipating heat away from the application and then dissipating the heat into the ambient air. This is accomplished through the process of thermal transfer, which relies on the interaction between heat and materials. Heat is transferred from the application to the heat sink by conduction, convection, and/or radiation. The heat sink then dissipates the heat away from the application by convection.

The ATS-06A-100-C3-R0 heat sink is designed specifically to provide maximum levels of thermal transfer and cooling capabilities. The heat sink features a unique shape and airflow patterns designed to increase thermal dissipation. Additionally, the ATS-06A-100-C3-R0 utilizes aluminum fins to further improve thermal transfer and cooling capabilities.

The ATS-06A-100-C3-R0 also has a fan mount for easy installation of a fan. This allows the heat sink to operate more effectively, as the fan will help to dissipate heat away from the application even faster. Additionally, the fan mount makes the ATS-06A-100-C3-R0 compatible with a variety of different fans, making it easy to customize the cooling solution to any application.

Conclusion

The ATS-06A-100-C3-R0 heat sink is a reliable thermal management solution for a variety of different applications. This heat sink is made from black anodized aluminum for maximum heat transfer capabilities and features a clip-on fan mount for easy installation. Additionally, the ATS-06A-100-C3-R0 utilizes aluminum fins and various airflow patterns to further improve cooling and thermal management.

The specific data is subject to PDF, and the above content is for reference

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