ATS-06A-140-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06A-140-C1-R0-ND

Manufacturer Part#:

ATS-06A-140-C1-R0

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-140-C1-R0 datasheetATS-06A-140-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.87721
30 +: $ 2.79909
50 +: $ 2.64361
100 +: $ 2.48812
250 +: $ 2.33264
500 +: $ 2.25488
1000 +: $ 2.02162
Stock 1000Can Ship Immediately
$ 3.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are thermal components designed to transfer heat from a hot location to a cooler area. Heat sinks are usually used to dissipate heat generated by electronic hardware, such as computers, video cards, and other components. The ATS-06A-140-C1-R0 is a heat sink designed to dissipate heat efficiently while keeping components cool.

This type of heat sink is composed of a finned aluminum base, which is covered with a large number of small metal or plastic fins. The fins act as an extended surface area to increase the rate of heat dissipation. The fins are typically spaced in such a way as to maximize air convection, allowing air to pass through the fins and dissipate the heat.

The ATS-06A-140-C1-R0 is designed for use in systems that require higher levels of heat dissipation. It is ideal for applications where space is limited and heat dissipation needs to be maximized. The heat sink is suitable for use with high-performance CPUs, GPUs, and other devices that generate considerable amounts of heat, and can be used in a variety of applications, such as gaming, industrial, and automotive.

The ATS-06A-140-C1-R0 heat sink is designed to take advantage of both thermal conduction and convection to dissipate heat. Thermal conduction occurs when heat is transferred from one material to another, while convection occurs when air is used to carry heat away from a hot source. The heat sink is designed to take advantage of both processes to maximize the rate of heat dissipation.

The ATS-06A-140-C1-R0 is designed for optimal thermal performance, with a fin pitch of 0.55 cc/in, a thermal resistance rating of 0.08 C/W, and an overall effectiveness of 95%. The fin pitch is the space between the fins of the heat sink, and the thermal resistance rating is the ability of the heat sink to prevent heat from being transferred from one component to another. The overall effectiveness rating is the measure of how well the heat sink can transfer and dissipate heat.

The ATS-06A-140-C1-R0 is designed for easy installation and maintenance. It comes pre-assembled and includes all of the necessary fasteners for installation. In order to maximize the performance of the heat sink, it is important to keep it clean and free of dust and debris. This can be done by regularly removing the fin assembly and dusting it with a lint-free cloth.

The ATS-06A-140-C1-R0 is an efficient and reliable heat sink which is ideal for applications where space is limited and high levels of heat dissipation are required. It is designed for optimal thermal performance and easy installation and maintenance. With its high level of effectiveness and low thermal resistance rating, the ATS-06A-140-C1-R0 heat sink is an excellent choice for any system requiring effective heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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