ATS-06A-156-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06A-156-C3-R0-ND

Manufacturer Part#:

ATS-06A-156-C3-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-156-C3-R0 datasheetATS-06A-156-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays an important role in the performance of electronic and other digital devices. Heat exchangers, also called heat sinks, are essential components in thermal management. ATS-06A-156-C3-R0 is one type of heat sink designed to manage the thermal for many application fields.

ATS-06A-156-C3-R0 is a heat sink that is composed of 6063-T9 aluminum with a thermal paste between the heatpipe and the cooling fins. It is designed with an optimal structure in order to ensure efficient cooling performance. The heat sink features a 20mm setback base plate, which helps to dissipate the heat and reduce thermal resistance while providing a wide contact area with the mounting surface. In addition, the heat-dissipating fins are angled to allow more surface area for the cooling fins to interact with the air and maximize heat conducting. This makes the heat sink suitable for high power applications, including industrial equipment, embedded systems, server systems, telecom systems, and more.

The working principle of ATS-06A-156-C3-R0 heat sink is based on the concept of thermoelectric cooling. The thermoelectric effect utilizes two different materials that are able to conduct heat differently, and it is used to transfer heat from one side of the device to the other. The refrigerant tube is embedded in the aluminum body of the heat sink, and it utilizes a thermoelectric cooling mechanism to transfer heat across the tube. The heat is then dissipated through the cooling fins. This allows for more efficient and effective cooling compared to traditional heat sinks.

Due to its unique design and effective cooling method, ATS-06A-156-C3-R0 heat sink offers superior thermal performance for a variety of applications. It is suitable for use in various industries, such as automotive, industrial, medical, aerospace, and more. This cost-effective heat sink is designed for a range of applications, including cooling electronic components, power electronics, LEDs, ICs, processors, GPUs, and cooling components. In addition, the heat sink is corrosion-resistant, non-conductive, and self-cleaning, making it an ideal thermal solution for demanding environments.

Overall, ATS-06A-156-C3-R0 heat sink is a reliable and efficient thermal solution for many applications. With its strong construction and thermoelectric cooling technology, this heat sink offers superior thermal performance and is suitable for many industries. Its cost-effective design and ability to dissipate the heat effectively make it an ideal solution for various applications. This makes ATS-06A-156-C3-R0 heat sink a great choice when delivering reliable thermal management solutions.

The specific data is subject to PDF, and the above content is for reference

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