ATS-06A-174-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06A-174-C1-R0-ND

Manufacturer Part#:

ATS-06A-174-C1-R0

Price: $ 3.70
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-174-C1-R0 datasheetATS-06A-174-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.36420
30 +: $ 3.27348
50 +: $ 3.09154
100 +: $ 2.90972
250 +: $ 2.72785
500 +: $ 2.63691
1000 +: $ 2.36412
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are commonly used in many different applications for a variety of reasons. One of the most popular types of thermal heat sinks is the ATS-06A-174-C1-R0, which is widely available and used in many different industries for its effectiveness in thermal management and control. This article looks at the application field and working principle of the ATS-06A-174-C1-R0 in detail.

The ATS-06A-174-C1-R0 thermal heat sink is designed primarily for controlling thermals in high intensity, temperature sensitive electronic components. It features a high efficiency, low profile design and is typically used in space-constrained environments such as computers, laptops, and other high-powered electronic devices. The unique design of the thermal heat sink provides a very effective cooling solution compared to traditional methods.

The ATS-06A-174-C1-R0 is constructed from aluminum and is designed to quickly and effectively dissipate heat energy from sensitive electronic components. It features a small size and low profile design, which is ideal for applications where space is limited. The thermal heat sink uses a combination of convection and conduction to quickly dissipate heat energy from the components. The heat generated by the electronic components is transferred to the fins on the heat sink and is quickly dissipated to the surrounding environment. This process helps to keep the temperature of the components below their specified operating temperature, ensuring optimal performance.

The thermal heat sink is designed to be used in a variety of applications, including computers, audio equipment, medical device, LED lighting, and automotive components, amongst others. In addition to dissipating heat energy, the thermal heat sink also helps to protect the components from damage due to overheating. By providing sufficient cooling, the thermal heat sink helps ensure optimal performance of the components. By maintaining a stable temperature, the life expectancy of the components is also extended.

The ATS-06A-174-C1-R0 thermal heat sink is available in a variety of sizes depending on the application requirements. Additionally, the fins of the heat sink can be customized to meet specific requirements, such as performance or aesthetic look. The heat sink also features a rugged construction for maximum durability, and is designed to resist vibration and shock.

In conclusion, the ATS-06A-174-C1-R0 is an effective thermal management and control solution, and is suitable for a wide variety of applications such as computers, audio equipment, medical device, LED lighting, and automotive components. Its high-efficiency, low-profile design helps to quickly and effectively dissipate heat energy from sensitive components, while also providing protection from damage due to overheating. The ATS-06A-174-C1-R0 thermal heat sink is the ideal choice for those looking for a reliable thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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