ATS-06A-18-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.37°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks and ATS-06A-18-C1-R0

Thermal - Heat Sinks are used in many industries such as electronics, automotive, and aerospace. These devices are used to regulate the temperature of components. Heat sinks are typically connected to a heat source to dissipate and absorb its heat output. Heat sinks serve the purpose of reducing the heat generated by a system, and they use a thermodynamic process to transfer heat from one medium to another. ATS-06A-18-C1-R0 is a type of thermal - heat sink which is widely used in the industry.

Application Field of ATS-06A-18-C1-R0

The application field of ATS-06A-18-C1-R0 heat sinks is mainly in the consumer electronics industry. It can be used for cooling a vast range of electronic products such as mobile phones, navigation systems, gaming consoles and MP3 players. The ATS-06A-18-C1-R0 heat sink can also be used in applications that require reliable thermal regulation of components, such as those in automotive, aerospace, and medical industries.

Working Principle of ATS-06A-18-C1-R0

The ATS-06A-18-C1-R0 heat sink makes use of a thermodynamic process for heat transfer. This process utilizes the concept of convection to transfer heat. Convection is the movement of heat from a hot to a cold medium. In the ATS-06A-18-C1-R0 heat sink, air is used as the medium through which heat is transferred. This air passes over the heat source, absorbs the heat, and circulates it away from the source. This process of air convection is responsible for the efficient cooling of the heat source.

Design and Structure of ATS-06A-18-C1-R0

The ATS-06A-18-C1-R0 heat sink is designed to perform optimally in the consumer electronics industry. The heat sink features a highly efficient aluminum material that has superior heat conduction and dissipation. The aluminum material is laminated onto a substrate that provides high thermal conductivity and improved heat dissipation. In addition to aluminum, the ATS-06A-18-C1-R0 heat sink also includes an array of fins that help to efficiently dissipate the absorbed heat. These fins are arranged in a lattice-like structure and are designed to maximize airflow for improved cooling.

Conclusion

In conclusion, the ATS-06A-18-C1-R0 heat sink is an essential component of the thermal - heat sink industry. The device is designed to provide efficient cooling for a variety of electronic products and components. The heat sink utilizes a thermodynamic process and includes an array of fins for optimized heat dissipation. The ATS-06A-18-C1-R0 heat sink is a reliable and efficient device for regulating temperature in a variety of applications.

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