ATS-06A-189-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS10668-ND

Manufacturer Part#:

ATS-06A-189-C2-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-189-C2-R0 datasheetATS-06A-189-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.25880
10 +: $ 4.14099
25 +: $ 3.91079
50 +: $ 3.68084
100 +: $ 3.45076
250 +: $ 3.22071
500 +: $ 2.99066
1000 +: $ 2.93315
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-06A-189-C2-R0 Thermal - Heat Sinks Applications and Working Principles

Thermal - Heat Sinks technology is used in a wide variety of applications, from cooling computer processors and other electronic circuits, to protecting sensitive electrical components from heat generated by frictional forces. ATS-06A-189-C2-R0 Thermal - Heat Sinks technology is one of the most popular and effective solutions to these challenges. This article will discuss the application field and working principle of ATS-06A-189-C2-R0 Thermal - Heat Sinks.

Applications of ATS-06A-189-C2-R0 Thermal - Heat Sinks

ATS-06A-189-C2-R0 Thermal - Heat Sinks can be used in a variety of devices and applications, including computers, laptops, servers, digital cameras, and other electronic components. The most common application of Thermal - Heat Sinks is to provide effective cooling to the central processing unit (CPU) and other electronic components in order to ensure proper device operation. This type of heat sink also ensures that critical components of a computer, laptops, or other electronics do not overheat due to either inadequate air circulation or inadequate cooling inside the device.In addition to cooling devices, ATS-06A-189-C2-R0 Thermal - Heat Sinks can also be used to protect sensitive electrical components from possible damage caused by excessive frictional heating. Frictional heating can occur when high-speed electrical components, such as rheostats, are in contact with each other. The Thermal - Heat Sinks absorbs this frictional heat, preventing damage to the components. This type of heat sink can also be used to dissipate electrostatic charges.

Working Principle of ATS-06A-189-C2-R0 Thermal - Heat Sinks

ATS-06A-189-C2-R0 Thermal - Heat Sinks works by transferring heat away from sensitive electrical components. This is accomplished through thermal convection, which is the natural process of convection by which heat is moved from one part of a material or system to another. The heat sink collects heat from the components and dissipates it to the surrounding air through the dissipation of photons emitted from the fins attached to the heat sink. The thermal conductivity of the metal fins allows for efficient heat transfer away from the heat source.The fin area of ATS-06A-189-C2-R0 Thermal - Heat Sinks is composed of a large number of small fins. These fins help to increase the surface area of the sink, while also creating a greater number of contact points. This serves to increase the rate of heat transfer from the heat source and the surrounding air. The fins are also designed to maximize air flow, allowing for improved cooling of the system.In conclusion, ATS-06A-189-C2-R0 Thermal - Heat Sinks is a highly effective solution for cooling delicate electrical components and protecting them from frictional overheating in a variety of applications. The fin area of this type of heat sink increases the surface area of the sink and helps to increase the contact points between the heat source and the surrounding air. This allows for improved heat dissipation and effective cooling of the components.

The specific data is subject to PDF, and the above content is for reference

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