ATS-06A-19-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06A-19-C3-R0-ND

Manufacturer Part#:

ATS-06A-19-C3-R0

Price: $ 4.49
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-19-C3-R0 datasheetATS-06A-19-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.03704
30 +: $ 3.81255
50 +: $ 3.58823
100 +: $ 3.36401
250 +: $ 3.13974
500 +: $ 2.91548
1000 +: $ 2.85942
Stock 1000Can Ship Immediately
$ 4.49
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is the technique of regulating the flow of heat from one object to another, typically from an electronic component to the surrounding environment. Heat sinks are an essential part of this process because they have the ability to dissipate high amounts of heat away from a component. The ATS-06A-19-C3-R0 heat sink is designed for applications that require efficient cooling for high-powered components. It is a compact heat sink that features a thermal resistance of 0.070°C/W and a thermal mass of 19.7 cm2, making it suited for a variety of thermal management applications.

The ATS-06A-19-C3-R0 is manufactured with high-performance aluminum, making it strong yet lightweight. It also includes vertical fins that help to dissipate heat quickly and efficiently. This model has a variety of sizes available, so it can be suitable for a wide range of components and products, such as LED lighting, power amplifiers, and laser diodes. The heat sink can also be mounted in several different locations to maximize heat dissipation.

The working principle of the ATS-06A-19-C3-R0 heat sink is quite simple. It works by transferring heat away from a component using a combination of thermal conductivity and convection. The design of the heat sink features several fins that run the length of the device. These fins are designed to trap air that has been warmed by the component and then dissipate it away from the component using convection. Additionally, the aluminum material of the heat sink is designed to be a good conductor of heat, so it absorbs heat away from the component and circulates it back into the fins where it is released into the air.

The ATS-06A-19-C3-R0 is a reliable and effective thermal management solution for a wide range of applications. It is designed to provide a durable and efficient way to dissipate heat away from components while putting minimal strain on the system as a whole. The design allows for flexibility in terms of mounting location, so it can be fitted to existing designs without additional modifications. Additionally, the lightweight construction makes it easy to handle and quickly install. Its thermal resistance of 0.070°C/W is ideal for components that require high power levels, such as LEDs or lasers.

The ATS-06A-19-C3-R0 is a great heat sink solution for a variety of applications. It is designed to provide efficient cooling for components that require high power levels, while keeping the overall system light and easy to handle. The heat sink also offers flexibility in terms of mounting location, making it suitable for a wide range of products. By utilizing both thermal conductivity and convection, the ATS-06A-19-C3-R0 provides reliable and efficient thermal management at an affordable price. Together with its low thermal resistance and thermal mass, the ATS-06A-19-C3-R0 is an excellent choice for any thermal management application.

The specific data is subject to PDF, and the above content is for reference

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