| Allicdata Part #: | ATS-06A-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-06A-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06A-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks are devices that are designed to transfer the thermal heat from one source to another. They are commonly used in electronics, computers, and other applications. The term “sink” refers to the fact that the heat will sink to the area of greater heat exchange. Heat Sinks are designed to reduce the thermal resistance by dissipating the thermal energy to the surrounding environment.
ATS-06A-20-C1-R0 application field and working principle
The ATS-06A-20-C1-R0 Heat Sink is designed for applications in thermal management. The device is designed to dissipate heat from the high heat-generating components in several types of equipment. The device is designed to allow heat to be transferred from the source to a lower temperature sink. The ATS-06A-20-C1-R0 Heat Sink has a large cooling area and is made of a copper coated with a thermal conductive material to provide maximum heat dissipation.
The Heat Sink is designed with pins that are used to attach the device to the equipment being cooled. The pins also provide electrical insulation from the heat sink and the surrounding environment. The device utilizes a unique design with an array of fins that are straight, curved, and diagonal to create a large surface area for improved heat transfer efficiency. The Heat Sink uses an integrated fan cooling system to circulate air which helps to dissipate the heat.
The device is designed to be used in systems where space is a factor. The Heat Sink is made of a high quality, durable material that is resistant to corrosion and can withstand temperatures up to 120 degrees Celsius. The device utilizes a fanless design which helps to reduce the noise level and minimize dust accumulation in the fan blades. The Heat Sink is designed with a high-efficiency heat pipe technology to improve the thermal conductivity.
The Heat Sink can be mounted horizontally, vertically, or at any other angle. The device is designed with an adjustable mounting bracket which allows for secure and quick installation. The Heat Sink uses a combination of heat pipes, fins, and fan cooling to efficiently transfer the heat from the source to the sink. The Heat Sink has a durable construction and is designed for high reliability. The device is UL listed and approved for use in a variety of applications.
The Heat Sink is designed to be used in various applications such as medical equipment, telecommunications, and computers as well as for cooling of LED lighting and other semiconductor components. The Heat Sink is designed to provide an efficient heat transfer that is both cost-effective and efficient. The device is designed to provide excellent thermal conductivity and dissipates heat from the source to the sink quickly and efficiently.
In conclusion, the ATS-06A-20-C1-R0 Heat Sink is designed for thermal management applications. The device uses a combination of pins, fins, and fan cooling to dissipate the heat. The Heat Sink has a durable construction and is designed to provide maximum heat transfer efficiency. The device is UL listed and approved for use in a variety of applications.
The specific data is subject to PDF, and the above content is for reference