| Allicdata Part #: | ATS-06A-32-C1-R0-ND |
| Manufacturer Part#: |
ATS-06A-32-C1-R0 |
| Price: | $ 5.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06A-32-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.71933 |
| 30 +: | $ 4.45704 |
| 50 +: | $ 4.19492 |
| 100 +: | $ 3.93271 |
| 250 +: | $ 3.67053 |
| 500 +: | $ 3.40835 |
| 1000 +: | $ 3.34281 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential factor to consider when designing and constructing electrical systems. Heat sinks are used to regulate temperatures in various applications such as computers, gadgets, and vehicle components. On this note, ATS-06A-32-C1-R0 heat sink is one of the most efficient heat sinks available in the market. This article seeks to explain its application field and working principle.
ATS-06A-32-C1-R0 is multi-chip device made from aluminum that is constructed using a Micro-Channel cooling technology. It is suitable for use in on-board thermal solutions, battery coolers, CPUs, embedded applications, LED lighting, mobile phones, and other electronic designs. This small but powerful device consists of a material that has strong thermal reduction capabilities, making it a top choice for applications with high temperature flux.
The ATS-06A-32-C1-R0 features Anti-cross Contamination Cooling, which makes sure that no cross-contamination of liquid or gas occurs. This improves the life span of the device, since particles from the media don\'t get into its confined environment. Furthermore, it has a low thermal resistance rating, which along with its strong heat dissipation capabilities makes it an ideal choice for applications that involve a lot of heat transfer.
In terms of its working principle, ATS-06A-32-C1-R0 is designed to transfer the heat from the chip to the heat sink via a Multi-Chip Module (MCM). This process is achieved through a mini-fabricated fan that pushes hot air from the chip and into the heat sink. The hot air then passes through a series of thermally conductive aluminum fins that capture and dissipate the heat away from the chip, where it is released into the air. As the air passes through the fins, it is cooled and the temperature of the chip is stabilized.
Overall, ATS-06A-32-C1-R0 is an efficient, multi-functional heat sink that is suitable for a variety of applications. Its Anti-cross Contamination Cooling and low thermal resistance rating make it an ideal choice for applications that involve a lot of heat transfer. The mini-fabricated fan also ensures that the heat from the chip is efficiently transferred to the heat sink. Furthermore, its strong heat dissipation capabilities make it an ideal choice for high temperature flux environments.
The specific data is subject to PDF, and the above content is for reference