ATS-06A-39-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.230" (5.84mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.93°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-06A-39-C1-R0 application field and working principleHeat sinks are devices designed to dissipate heat energy from an electronic device or component while in operation. Heat sinks are widely used in the electronics industry due to their ability to transfer heat away from the device or component, thus preventing it from overheating and malfunctioning. It is especially important for devices and components that are highly sensitive to the heat generated when in operation.The ATS-06A-39-C1-R0 heat sink is a popular device often used in applications where they need to dissipate heat away from delicate components or large scale system requirements. This heat sink is specifically designed to provide excellent thermal performance while consuming less power and space. This ensures that the device operates efficiently and effectively without consuming too much power and space.The ATS-06A-39-C1-R0 heat sink is designed with aluminum fins and copper base to facilitate heat transfer from the component to the fins. The heat flux from the component is then absorbed by the copper base and quickly spread through the fins via convection heat transfer. This allows the heat flux to be effectively and efficiently dissipated away from the component.The ATS-06A-39-C1-R0 heat sink is designed to provide excellent cooling stability. It is composed of anodized aluminum and copper railings, which together provide excellent thermal conduction. The heat sink is designed to accommodate numerous types of components, such as processors, graphics cards, desktops, and industrial computing applications. It is also designed to fit multiple-range applications, such as liquid cooling systems, rectifiers, regulators, and more.The ATS-06A-39-C1-R0 heat sink is also designed to provide good heat dissipation efficiency. It is designed with fins that are arranged in a pattern optimized to provide an optimal air flow across them, allowing for the heat flux to be dissipated with maximum efficiency. The heat sink also features a patented fan housing technology which allows it to increase air flow, thus improving cooling performance. This greatly reduces the amount of power wastage and cuts down on the overall running temperature of the device or component.The ATS-06A-39-C1-R0 heat sink is an ideal device for systems that must remain cool and efficient while running. The device has a unique set of features that make it one of the most reliable and space-saving heat sinks available in the market. As such, it is widely used in applications that require excellent thermal performance while consuming less power and space.

The specific data is subject to PDF, and the above content is for reference