ATS-06A-45-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06A-45-C1-R0-ND

Manufacturer Part#:

ATS-06A-45-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06A-45-C1-R0 datasheetATS-06A-45-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.95°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal Heat Sinks are essential components in many industries. ATS-06A-45-C1-R0 is a thermal heat sink that provides reliable and efficient cooling and thermal management for a variety of applications. This article will discuss the application field and working principles of ATS-06A-45-C1-R0.

Application Field

ATS-06A-45-C1-R0 thermal heat sink is suitable for a wide range of applications. It is designed to provide reliable and efficient cooling in medical, telecommunications, aerospace and industrial applications. The broad application range of this heat sink makes it an ideal choice for a variety of industries. ATS-06A-45-C1-R0 is suitable for such high-performance components as CPUs, GPUs, FPGAs, PLDs, ASICs, and DC-DC converters.

In addition, the ATS-06A-45-C1-R0 thermal heat sink is suitable for use in low-profile, space-limited applications. Its dimensions are just 45x45x13.8mm, making it an excellent choice for applications which require high performance, but need to minimize the space available for cooling. This makes the ATS-06A-45-C1-R0 an ideal thermal solution for consumer electronics and embedded applications.

Working Principle

The ATS-06A-45-C1-R0 uses a combination of convective and conductive heat dissipation to provide reliable and efficient cooling. The heat sink is composed of a copper base, which is thermally connected to the component, and an array of aluminum fins which serve as the heat spreader for convection. The fins are arranged in a staggered pattern to maximize the surface area exposed to the ambient environment, thereby increasing the heat transfer efficiency of the ATS-06A-45-C1-R0.

The combination of copper and aluminum make the ATS-06A-45-C1-R0 an excellent thermal solution. Copper is an excellent conductor of heat, and the aluminum fins provide an excellent surface for convective cooling. The heat is efficiently drawn away from the component and dissipated into the environment. This provides reliable and efficient cooling, even when the surrounding environment is hot.

The ATS-06A-45-C1-R0 also provides protection against overheating. The fins are coated with a black epoxy heat-dissipation paint, helping to reduce the temperature of the fins even further. The paint also serves to absorb some of the heat, further ensuring that the component does not get overheated.

In conclusion, the ATS-06A-45-C1-R0 is a reliable and efficient thermal heat sink suitable for a wide range of applications. Its combination of copper and aluminum makes it an excellent thermal solution, and the black epoxy coating provides additional protection against overheating. It is ideal for use in low-profile, space-limited applications and can provide reliable and efficient cooling even in hot environments.

The specific data is subject to PDF, and the above content is for reference

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