| Allicdata Part #: | ATS-06A-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-06A-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06A-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction: ATS-06A-60-C1-R0 is a thermal-heat sink. It is designed to disperse the excess heat generated by electronic components. The heat generated is absorbed by the metal fins of the heat sink and dissipates in the atmosphere. The device is used in cooling electronic components such as processors, resistors, capacitors and other microchips.
Overview: The ATS-06A-60-C1-R0 is a two-piece design. The base of the heatsink is made of anodized aluminum and is bonded with a thermal epoxy adhesive. The fins of the heat sink are formed by tall copper plates.
Benefits: The ATS-06A-60-C1-R0 heat sink is highly efficient and reliable. It is effective even in high-temperature environments. The device absorbs the heat generated by the electronic component and efficiently dissipates the temperature without causing any damage to the component itself. The device is also relatively lightweight and easy to install.
Application Field: The ATS-06A-60-C1-R0 heat sink can be used in a variety of applications including telecommunications, consumer electronics, defence, aerospace, networking, automotive and automation. The device is used in cooling computer processors, digital signal processors (DSPs), memory chips, resistors, logic circuits, and other sensitive electrical components.
Design and Materials: The ATS-06A-60-C1-R0 is a lightweight two-piece heatsink. The base of the heatsink is made of anodized aluminum with a black oxide finish. The fins of the device are formed by tall copper plates. The copper fins provide increased surface area to absorb heat and rapidly dissipate the temperature. The device also features an integrated thermal epoxy adhesive which enables it to remain firmly mounted on the component.
Heat Transfer Mechanism: The ATS-06A-60-C1-R0 utilizes convection as its main heat transfer mechanism. Heat generated by the electronic component is absorbed by the base of the heat sink and transferred to the copper fins. The heat is then dissipated in the atmosphere by the convection mechanism. The device is also designed to minimize the thermal resistance between itself and the component to ensure effective heat transfer.
Installation Process: The ATS-06A-60-C1-R0 heat sink is relatively easy to install. The device requires no additional mounting bracket or support structure. It is simply attached directly onto the component using the integrated thermal epoxy adhesive. Once the adhesive bond has been set, the heat sink is securely attached to the component and ready to start dissipating the heat.
Conclusion: The ATS-06A-60-C1-R0 is a highly efficient thermal-heat sink. It is designed to efficiently disperse the excess heat generated by electronic components and provide reliable cooling. The device is lightweight and easy to install, making it a perfect device for cooling various electronic components. With its efficient heat transfer mechanism and reliable construction, the ATS-06A-60-C1-R0 is an ideal choice for cooling a variety of components.
The specific data is subject to PDF, and the above content is for reference