ATS-06A-60-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.50°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal-Heat Sinks and the ATS-06A-60-C3-R0

Thermal-heat sinks are devices that are designed to transfer heat away from components in a system, thus dissipating the heat in the environment and cooling down the other components. If a component such as a processor becomes too hot, its performance may decrease or it may even get damaged, and hence it is important to keep it cooled.Heat sinks are mounted to the surfaces of components to allow heat to be carried away by convection or conduction processes. They are used in a wide range of applications such as computers, medical equipment, and home appliances. Heat sinks are also used in industrial processes and in power electronics.The ATS-06A-60-C3-R0 is a thermal-heat sink specific designed for cooling components with up to 6A of current. It is an aluminum heat sink that comes with pre-applied high-performance thermal compounds to help facilitate better heat transfer between components and the heat sink. This particular heat sink has a unique shape, designed for efficient cooling of the components in any given system.

Application Field

The ATS-06A-60-C3-R0 thermal-heat sink is suitable for a broad range of applications, such as computers, medical equipment, home appliances, industrial processes and power electronics. Its large surface provides great cooling power, and its pre-applied thermal compounds help to increase heat exchange. It has been mainly used in computers and other digital devices, as it is a highly efficient and cost-effective cooling solution for these types of components.In computers, the ATS-06A-60-C3-R0 thermal-heat sink can be used to cool down processors, RAM, chipsets, and other components that generate a high amount of heat. This type of heat sink is also used in devices such as video game consoles, which require efficient cooling for their components. Additionally, it can be used to cool down various other components such as voltage regulators or motor controllers.

Working Principle

Heat is generated by components in electrical equipment, and heat sinks are used to transfer this heat away from the components. The ATS-06A-60-C3-R0 thermal-heat sink works using both convection and conduction processes.The convection process is based on the fact that air can be heated by the heat emanating from the component. This warm air then rises and cool air takes its place, repeating the process. The heat sink is designed to maximize this air flow and thus optimize heat transfer.In conduction, heat is transferred from one body to another by direct contact. The ATS-06A-60-C3-R0 thermal-heat sink has pre-applied high-performance thermal compounds that optimize heat transfer between the component and the heat sink. This type of heat sink is designed to be in contact with the component to facilitate efficient heat transfer.

Conclusion

The ATS-06A-60-C3-R0 thermal-heat sink is a highly efficient and cost-effective cooling solution for a wide range of applications. It is designed to optimize convection and conduction processes to ensure efficient heat transfer from components. This type of heat sink has closely-spaced fins to maximize air flow, and it also comes with pre-applied high-performance thermal compounds to maximize heat exchange between the component and the heat sink.

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