| Allicdata Part #: | ATS10756-ND |
| Manufacturer Part#: |
ATS-06A-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06A-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of modern electronics and electric systems. Microprocessors, power systems and even automotive systems all require effective thermal solutions to operate properly. TheATS-06A-97-C2-R0 is a high-performance heat sink designed to provide superior performance and thermal management characteristics for a variety of applications.
The ATS-06A-97-C2-R0 is a low-profile finned heat sink that features unique split-fin design for superior performance. The split-fin design maximizes the surface area of the heat sink, allowing more efficient heat dissipation than conventional single-fin designs. The heat sink also features a flat base that is optimized for uniform heat transfer and contact with the device or component to be cooled. The heat sink’s base is made of high-grade aluminum for superior heat dissipation, thermal insulation and durability. The fins are made of durable ABS plastic for increased life and increased resistance to chemicals and solvents.
The ATS-06A-97-C2-R0 heat sink is suitable for use with a variety of devices and components, including microprocessors, power electronics and automotive electronics. Its split-fin design is especially well-suited to environments that require high levels of convection cooling, where traditional single-fin designs may be less effective. In addition, the heat sink’s high-grade aluminum base and ABS plastic fins provide superior thermal insulation to protect sensitive components and devices from heat damage.
The ATS-06A-97-C2-R0 heat sink also features a variety of mounting options to accommodate different components and applications. The heat sink is available with either soldering or screw-type mounting options, depending on the needs of the application. Additionally, the heat sink comes equipped with thermal interface pads to ensure good contact between the heat sink and the component it is cooling.
The ATS-06A-97-C2-R0 heat sink is an excellent choice for applications that require efficient thermal management and reliable protection from heat damage. Its split-fin design maximizes the surface area of the heat sink, providing more efficient cooling than conventional designs. Additionally, the high-grade aluminum base and ABS plastic fins provide superior thermal insulation and durability. The heat sink is available with a variety of mounting options to suit different components and applications, and is an excellent choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference