| Allicdata Part #: | ATS-06B-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-06B-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential for many electronic components, allowing them to dissipate heat and remain in optimal operating conditions. The ATS-06B-10-C3-R0 is a popular thermal heat sink which can be used in a wide range of applications.
The ATS-06B-10-C3-R0 is constructed from high-quality aluminum, with a black anodized finish to provide resistance to corrosion and oxidation. The heat sink has 10 fins, providing excellent cooling performance and a large surface area for heat to be transferred away from the component. The heat sink also includes a clip mount, ensuring it will stay secure even when installed in potentially vibration-prone environments. The overall dimensions of the heat sink are 85 x 85 x 25mm (L x W x H), making it an ideal choice for uses that require a larger than average heat sink.
The ATS-06B-10-C3-R0 is designed to be used with a wide variety of electronic components, including high wattage devices such as CPUs, FPGAs, GPUs, and power supplies. The heat sink can also be used to dissipate heat from small components such as SDRAM and other memory modules. Where increased cooling performance is required, the ATS-06B-10-C3-R0 can be mounted with a fan to provide even better cooling efficiency.
In order to understand how the ATS-06B-10-C3-R0 works, it is important to understand the basic principles of how heat is transferred. Heat is a form of energy and, as such, will follow the laws of thermodynamics. Heat is transferred from one material to another by both conduction and convection. Thermal conduction occurs when heat moves from a warmer material to a cooler one, through direct physical contact. Thermal convection occurs when heat is transferred by air or by boiling a liquid, and is most prevalent in air-cooled heat sinks.
The ATS-06B-10-C3-R0 is cleverly designed to take advantage of both conduction and convection to dissipate heat. Heat is drawn away from the component by the aluminum fins of the heat sink, through conduction, and then dissipated through convection as air moves over the surface of the fin array. This combination of thermal transfer techniques ensures that the ATS-06B-10-C3-R0 can provide excellent heat dissipation performance.
In conclusion, the ATS-06B-10-C3-R0 is an ideal thermal heat sink for applications that require excellent heat dissipation performance. The heat sink can be used to dissipate heat from a variety of components, and can be used with or without a fan. By making use of both conduction and convection, the heat sink is able to efficiently and effectively remove heat from any component, and keep them operating in optimal conditions.
The specific data is subject to PDF, and the above content is for reference