ATS-06B-134-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks, otherwise known as thermal management products, are designed to assist in the removal of heat generated from components or electronic devices such as CPUs and GPUs. An effective thermal management system requires the use of heat sinks, heat spreaders, and cooling fans. An efficient heat sink is essential for the performance and longevity of thermally-stressed components and systems.The ATS-06B-134-C2-R0 is a high-performance heat sink that maximizes the thermal performance in a wide variety of applications. This heat sink is a highly efficient device, designed for use in all types of applications, including computers, consumer electronics, military electronics, and more.

Applications

The ATS-06B-134-C2-R0 has a wide range of applications, including cooling processors, chipsets, GPUs, TECs, and other thermally dense components. This heat sink is designed to enhance system cooling performance in electrically and thermally demanding applications. It is an ideal solution for applications requiring cooling in narrow or confined spaces.The ATS-06B-134-C2-R0 is ideal for server and telecommunications equipment, medical equipment, industrial automation, and data center applications. It is an efficient and reliable thermal management solution for small form factor PCs, laptops, and motherboards.

Features & Benefits

The ATS-06B-134-C2-R0 offers an impressive combination of features and benefits. This thermal management device offers superior cooling performance compared to traditional air cooling solutions. It provides a more efficient cooling solution for thermally demanding applications.The ATS-06B-134-C2-R0 is designed to maximize thermal performance and minimize component temperatures. The heat sink is constructed from robust aluminum to ensure excellent heat dissipation. Its low profile design and copper layer ensure excellent thermal contact with the components it is cooling.The design also features a small footprint, allowing it to fit into most cases easily. The heat sink is designed to operate quietly, eliminating the need for noisy fans. The heat sink is also corrosion-resistant, and features a long life expectancy.

Working Principle

The ATS-06B-134-C2-R0 operates on the principle of convective heat transfer. As heat is generated by an electronic component or device, it is absorbed by the heat sink and then dissipated into the surrounding environment. This process of transferring heat occurs through the circulation of air molecules.The air molecules absorb heat from the component and search for the quickest route, which in most cases is through the fins of the heat sink. As the air molecules reach the ends of the fins, the heat is then dissipated into the atmosphere. This process of convective heat transfer is continuous, aiding in the regulation of temperatures in the components and devices.

Conclusion

The ATS-06B-134-C2-R0 is a highly efficient heat sink that offers superior thermal performance and reliable cooling performance for a wide range of applications. It is designed to efficiently dissipate thermal energy from components, allowing for more reliable long term operation. This heat sink features a robust aluminum construction and copper layer, ensuring excellent heat dissipation. The heat sink is designed to operate quietly, eliminating the need for fans, while providing superior thermal performance. This heat sink is an ideal solution for thermally demanding applications or components that require cooling in a confined space.

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