ATS-06B-142-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are one of the most important components of modern electronic systems because they are responsible for dissipating heat generated by equipment and components. The ATS-06B-142-C2-R0 is a type of heat sink designed to provide efficient cooling in many applications.The ATS-06B-142-C2-R0 heat sink is designed to provide low-noise cooling while having a high thermal efficiency. It is very light and thin, yet can handle a wide variety of applications due to its efficient thermal design. It is characterized by its “pin fin” surface structure which increases its surface area and therefore facilitates heat dissipation.The ATS-06B-142-C2-R0 heat sink is used in applications such as telecommunications, IT systems, control systems, and automotive systems. The main purpose of the device is to provide cooling and protection from overheating of circuits and components. The pin fin design increases its surface area and enhances the airflow, thereby providing efficient heat dissipation.The ATS-06B-142-C2-R0 heat sink is designed to work on both convective and conductive cooling principles. In convective cooling, the device uses the natural airflow of the environment in order to provide cooling. On the other hand, when conducting cooling, the heat energy is conducted away from the device to a heat sink or to the environment. The heat sink also helps in dissipating the heat generated by the components by providing an alternate path for the heat energy to flow away from the components.The ATS-06B-142-C2-R0 heat sink is designed to be used for both active and passive cooling applications. For active cooling, a fan or blower can be used to direct the airflow and provide forced cooling. For passive cooling, the device is designed to maximize the airflow over its surface area.The ATS-06B-142-C2-R0 heat sink can also be used in combination with a heat pipe, a device which transfers the heat energy from one point to another via a fluid medium. The heat pipe is connected to the heat sink and can improve the efficiency of the cooling system significantly.The ATS-06B-142-C2-R0 heat sink is designed to be used in applications with a wide temperature range. It is designed to withstand temperatures up to 125°C, which ensures that it can be used in applications where temperatures may fluctuate significantly.The ATS-06B-142-C2-R0 heat sink is designed to be used in combination with a variety of components such as processors, graphics cards, and other components. The device is also designed to be used in various conditions such as in a humid environment or in an environment where the temperatures may be very high.Overall, the ATS-06B-142-C2-R0 heat sink is an efficient heat sink device that can be used in a variety of applications. It is designed to be used in applications where cooling and protection from overheating of components is necessary. It can be used for active and passive cooling applications due to its efficient thermal design. The device is designed to withstand extreme temperatures and is designed to be used in combination with a wide variety of components for efficient cooling.

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