
Allicdata Part #: | ATS-06B-163-C3-R0-ND |
Manufacturer Part#: |
ATS-06B-163-C3-R0 |
Price: | $ 4.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X30MM L-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.15233 |
30 +: | $ 3.92175 |
50 +: | $ 3.69104 |
100 +: | $ 3.46040 |
250 +: | $ 3.22971 |
500 +: | $ 2.99902 |
1000 +: | $ 2.94134 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.99°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat SinksHeat sinks are one of the most common and widely-used components of any computer system. They are used to dissipate the heat generated by components of a computer system, usually by using either convection or conduction. ATS-06B-163-C3-R0 is a certificated heat sink that is designed to handle any environment.ATS-06B-163-C3-R0 is a certificated heat sink with two pin type mounting holes. It also has the ability to dissipate a large amount of heat in environments with less than optimal airflow. The heat sink is made out of aluminum alloy which is chosen for its durability and its ability to transfer and dissipate heat rapidly. The aluminum alloy is also designed to be able to endure high temperature and pressure. The surface of the heat sink is also treated with a corrosion-resistant coating which helps it to last longer in harsh environments. The size of the heat sink is 153x124x21mm and its weight is 430 grams. The purpose of a heat sink is to dissipate the heat of a component by providing a conduction path for the heat to travel from the component and into the air around it. Heat is transferred from the component by conduction which is the transfer of thermal energy through direct contact. Heat is dissipated from the heat sink through a process called convection which is the transfer of thermal energy through airflow. The sides and base of the heat sink are designed to maximize air flow so that the heat can be dissipated quickly and efficiently. ATS-06B-163-C3-R0 is designed for use in any environment to provide reliable cooling for a variety of applications. It can be used in computers, servers, industrial machines, and other electronic devices. It is perfect for applications that require a reliable, high-performance cooling solution with a compact design and low noise output. It is also an excellent choice for applications that require high airflow and low temperatures.One of the key advantages of ATS-06B-163-C3-R0 is its ability to dissipate large amounts of heat in environments with less than optimal airflow. This makes it ideal for applications in tight spaces or where traditional air-cooled solutions are not an option. Additionally, it is very reliable as it is rated to last for more than 50,000 hours of continuous use. It is also compatible with all major motherboard brands and is designed to operate without generating excessive noise. The ATS-06B-163-C3-R0 is an excellent choice for any application which requires a reliable, compact heat sink solution. It is designed to provide reliable cooling in any environment and its aluminum alloy construction ensures that it can withstand high temperatures and pressures. Additionally, its noise output is low and its corrosion-resistant coating helps to extend its life in harsh environments. Its ability to dissipate heat in environments with less than optimal airflow also makes it an excellent choice for tight spaces or applications which cannot accommodate traditional air-cooled solutions.The specific data is subject to PDF, and the above content is for reference
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