| Allicdata Part #: | ATS-06B-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-06B-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are commonly used to dissipate heat generated by electronic components and equipment. In order to use a heat sink in the best way, one needs to understand their application field and working principle. The ATS-06B-173-C1-R0 is a heat sink designed to help cool off electronic components. It is typically used in medium to high-power applications such as power amplifiers and switching power supplies. In this article, we will discuss the ATS-06B-173-C1-R0 application field and working principle.
The ATS-06B-173-C1-R0 is a thermally controlled heat sink which means that it is designed to minimize heat buildup in electronic components. It is made up of multiple fins with a larger thermal mass to dissipate heat efficiently. The fins are designed in such a way that they create an airflow channel to facilitate efficient cooling. The size of the fin is also important for good cooling performance as it directly affects its thermal mass and airflow characteristics.
The ATS-06B-173-C1-R0 heat sink also features a built-in fan with optimized cooling capacity. The fan has adjustable speed settings so that it can be set to the optimal level for cooling efficiency. The fan is protected by a guard, which ensures that dust and other particles don\'t build up and clog the heat sink\'s fins. The guard also helps to absorb vibration and noise.
The ATS-06B-173-C1-R0 has a thermal resistance of 0.3°C/W. This means that it is able to dissipate heat more efficiently. It is designed to work with a wide range of electronic components such as power amplifiers, switching power supplies, and microprocessors. The heat sink also has a corrosion-resistant construction, making it suitable for a wide range of operating environments.
The ATS-06B-173-C1-R0 heat sink works by dissipating the heat generated by electronic components. When heat is generated, it flows from the component to the heat sink through a transfer medium such as air or a thermal paste. The fins of the heat sink are then responsible for dissipating the heat into the surrounding atmosphere through convection. The fan then helps to increase the convection rate, further improving the heat dissipation efficiency.
In conclusion, the ATS-06B-173-C1-R0 is a thermally controlled heat sink with a built-in fan. Its fins are designed for maximum heat dissipation and the fan helps to further improve the cooling performance. Its thermal resistance is 0.3°C/W, making it suitable for a wide range of applications. The heat sink is corrosion-resistant and can be used in a variety of environments. With its cooling and thermal efficiency, the ATS-06B-173-C1-R0 heat sink is a great choice for cooling off electronic components.
The specific data is subject to PDF, and the above content is for reference