ATS-06B-175-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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<p>Heat sinks are often used in many different types of electrical and mechanical applications, such as LED lighting, motor cooling, or audio engineered components. The ATS-06B-175-C3-R0 is a a type of heat sink that is designed specifically for high power electronics applications, in cases where a high level of heat dissipation is required.</p><p>In order to prevent the kind of heat damage that can occur on any type of electrical device, a heat sink is typically employed to draw the heat away from the device. Heat sinks are made from a variety of materials such as copper, aluminum, or even ceramic. The ATS-06B-175-C3-R0 is made from aluminum and has a finned shape which helps to dissipate heat quickly in multiple directions.</p><p>The design of the ATS-06B-175-C3-R0 is also unique because it uses a patented 3D ventilation system which helps to increase the surface area available for heat dissipation. This patented system also creates better air flow over the fins, which improves the efficiency of the heat sink. In addition to this, the ATS-06B-175-C3-R0 has additional thermal ground lines and contact points which help to spread the heat dissipation over a larger area.</p><p>The ATS-06B-175-C3-R0 is often used in applications where high levels of power dissipation are needed from a single component, such as a transistor or semiconductor device. It can also be used in applications where ambient temperatures range from 0 to 100°C, making it a very versatile heat sink. The ATS-06B-175-C3-R0 is typically mounted onto the component using a combination of thermal pads, epoxy, or screws and is capable of dissipating up to 175 watts of power.</p><p>The working principle behind the ATS-06B-175-C3-R0 is simple but effective. By drawing the heat away from the component via the thermal ground lines and contact points, the fins of the heat sink create a large surface area which helps the component to dissipate the heat more quickly and evenly. This prevents any overheating of the component, ensures that it operates within its safe operating range, and helps to improve the overall performance and reliability of the device.</p><p>The ATS-06B-175-C3-R0 is a very effective heat sink for high powered electronic applications that require highest levels of heat dissipation. The patented 3D ventilation system helps to improve the efficiency of the heat sink and can be mounted easily using thermal pads, epoxy, or screws. With its versatile design, the ATS-06B-175-C3-R0 is an ideal choice for any application where high power dissipation is required.</p>

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