| Allicdata Part #: | ATS-06B-178-C1-R0-ND |
| Manufacturer Part#: |
ATS-06B-178-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-178-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management and cooling is an important consideration in the operation and service of sensitive electronic components. Heat sinks are designed to enhance thermal conductivity and improve cooling efficiency by dissipating heat energy away from sensitive components. The ATS-06B-178-C1-R0 is a robust thermal solution designed to manage the heat generated by high performance ASICs (application-specific integrated circuits).
Heat sinks are generally divided into two types; active and passive. Active heat sinks make use of fans or other cooling mechanisms to actively move heat away from the component being cooled. Passive heat sink designs, such as the ATS-06B-178-C1-R0, utilise natural convection (air flow) to draw heat away from the component being cooled.
The ATS-06B-178-C1-R0 is a premium quality heat sink designed to provide efficient thermal cooling of ASICs. The material choice, production process and fin design of the heat sink are all carefully selected to optimise heat transfer performance and thermal energy dissipation. Its fin design is streamlined and highly efficient, and the fin surface acts as a heat dissipation area to increase heat transfer efficiency.
The ATS-06B-178-C1-R0 heat sink is designed for application in a wide range of consumer electronics. It is particularly suitable for high performance ASICs utilised in gaming, broadcasting, high-speed networking and virtual reality applications. By cooling the ASICs in these applications, the ATS-06B-178-C1-R0 heat sink ensures components operate reliably and efficiently.
The ATS-06B-178-C1-R0 is constructed from premium quality extruded aluminium with an anodised finish to resist corrosion and further enhance heat dissipation. It is composed of a series of thermal fins, each of which is designed to maximise surface area and thus improve heat transfer performance. In order to further enhance heat dissipation, the fins are arranged in an efficient, uniform pattern and the interface between the heat sink and component is designed to provide efficient heat transfer.
The ATS-06B-178-C1-R0 heat sink also features an easy to install design. It is designed to be installed quickly and easily without the need for additional tools or fastening devices. It also features copper heat spreaders, which allow the body of the heat sink to be mounted directly to the chipsets of the ASICs for the most efficient heat distribution.
In summary, the ATS-06B-178-C1-R0 heat sink is an excellent thermal solution for cooling high performance ASICs. Its passive, convection-based design is highly efficient, and it is designed for the most efficient heat transfer and dissipation. It is also quick and easy to install, making it ideal for a range of consumer electronics applications.
The specific data is subject to PDF, and the above content is for reference