| Allicdata Part #: | ATS-06B-183-C1-R0-ND |
| Manufacturer Part#: |
ATS-06B-183-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-183-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.34°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of electronics engineering that helps to keep components within the operational temperature range. Heat sinks allow thermal energy to be transferred away from components more efficiently and provide additional cooling capacity. The ATS-06B-183-C1-R0 thermal heat sink is a great solution for a wide range of application fields.
The ATS-06B-183-C1-R0 is a finned heat sink designed for low- to medium-power applications. It has a total air flow of 8.0 m3/s, with a maximum airflow rate of 8.34 m3/s at an ambient air temperature of 25°C. It features an anodized aluminum extrusion, which provides improved thermal dissipation. The ATS-06B-183-C1-R0 is designed for a mount height of 48.2 mm, and a total weight of 105 grams.
The ATS-06B-183-C1-R0 is designed to work most efficiently in an environment with an airflow rate of above 8.0 m3/s, and a temperature range of between 0 and 80°C. It is rated for a maximum airflow of 8.34 m3/s at 25°C, and a maximum air temperature of 140°C before it needs to be replaced.
The ATS-06B-183-C1-R0 has a range of application fields, including power electronics, medical electronics, automotive electronics, consumer electronics and LED lighting. This heat sink is well suited for applications with high power requirements, as the finned design can dissipate more thermal energy than a flat surface can. Additionally, the ATS-06B-183-C1-R0 is designed to provide effective cooling in environments with higher ambient air temperatures.
The ATS-06B-183-C1-R0 works on the principle of convection cooling. This means that it utilizes the natural transfer of thermal energy from warmer components to cooler surrounding air. As the air passes through the fins, the thermal energy is dissipated from the heat sink, keeping components within an optimal temperature range.
The ATS-06B-183-C1-R0 is designed to provide good thermal performance in low profile designs. The anodized aluminum extrusion provides a low impedance path for thermal energy to be efficiently dissipated. It also offers a corrosion-resistant surface that is suitable for industrial grade applications.
In summary, the ATS-06B-183-C1-R0 thermal heat sink is a great solution for a wide range of application fields. It is designed to provide efficient heat transfer away from components, keep them within operational temperature ranges, and improve their life expectancy. With its finned design for increased thermal dissipation, and an anodized aluminum extrusion for improved corrosion resistance, the ATS-06B-183-C1-R0 is the perfect solution for low- to medium-power applications.
The specific data is subject to PDF, and the above content is for reference