| Allicdata Part #: | ATS-06B-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-06B-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been an integral part of electronic systems since the modern computing era began in the early 1980s. As technology has advanced, so too have the demands for keeping devices running cool and efficient. One of the more common methods for doing this is through the use of heat sinks, which have become increasingly popular.
The ATS-06B-20-C1-R0 is an off-the-shelf thermal solution designed to help keep electronic systems cool and to reduce their overall operating temperature. The product consists of a base assembly with four thermally conductive copper fins mounted on the interior surface. Each of the copper fins is surrounded by a polyamide insulation layer that provides a complete thermal circuit. The fins are connected to the base assembly by a series of clips and spacers.
The ATS-06B-20-C1-R0’s primary application is for cooling high-frequency electronics such as microprocessors and custom-designed circuit boards. The product is designed to be operating in any orientation, so it can be mounted in almost any system configuration. The thermal interface between the fins and the base assembly is designed to ensure maximum heat transfer and stress relief. This allows the heat sink to effectively lower temperatures inside electronic components, which in turn increases their efficiency.
The ATS-06B-20-C1-R0 also provides the added benefit of reducing environmental Impact for the electronics. The product is designed to meet current environmental regulations and can be used in a wide range of applications where efficiency and decreased environmental impact is needed. The product is also designed to withstand environmental conditions such as temperature and humidity.
In terms of its working principle, the ATS-06B-20-C1-R0 works by dissipating heat away from the device that it is connected to. Heat is transferred from the device to the fins of the heat sink, which are then cooled by the flow of air around them. This air is 20 to 30°F cooler than the device, so as air passes over the fins, it pulls heat away and out of the device.
The ATS-06B-20-C1-R0 is highly efficient and is one of the most reliable thermal management solutions around. It is designed to handle extreme temperatures and highly harsh environments, making it an ideal choice for a number of different applications. The product is also easy to install and requires minimal maintenance, making it a cost-effective solution for cooling high-frequency electronics.
The specific data is subject to PDF, and the above content is for reference