ATS-06B-25-C3-R0

The ATS-06B-25-C3-R0 is a heat sink designed to provide efficient dissipation of microprocessor heat. It is commonly used in applications requiring high thermal conductivity and low profiles. Its desirability for such applications comes from its low profile and high deformation resistance.

The ATS-06B-25-C3-R0 is composed of high-grade aluminum and has a profile height of only 5mm. It features a C-type fin structure with five fins connected by ribs. The fins provide maximum heat transfer and each unit offers sufficient contact between the heat sink and the processor. The ATS-06B-25-C3-R0 can dissipate up to 25 watts of energy without exceeding the processor’s allowable temperature limits.

The working principle of the ATS-06B-25-C3-R0 is based on the laws of thermodynamics. Heat is transferred from the processor to the heat sink, causing the heat sink to become hotter than the processor. As the heat sink gets hotter, it dissipates the energy to the surrounding air, and the processor gradually cools down. This is the same principle as convection, but it is applied on a much smaller scale.

The ATS-06B-25-C3-R0 is used in a variety of applications requiring high thermal conductivity and low profiles. Examples of such applications would include portable electronics such as laptops, tablets, and cell phones, as well as embedded systems requiring high-precision processing. Its advantage over other cooling solutions lies in its small size and low profile. This makes it ideal for applications where space is limited, such as slim electronic devices.

The ATS-06B-25-C3-R0 heat sink is an effective way of dissipating heat in small embedded systems and other small electronic devices. Its low profile and high deformation resistance makes it an ideal choice for applications that require efficient heat dissipation, without taking up too much space. It is an ideal solution for applications that require precision processing in demanding conditions.